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1. WO2018211644 - 光モジュール

公開番号 WO/2018/211644
公開日 22.11.2018
国際出願番号 PCT/JP2017/018583
国際出願日 17.05.2017
IPC
H01S 5/022 2006.1
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
02レーザ作用にとって本質的ではない構造的な細部または構成
022マウント;ハウジング
CPC
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01S 5/02345
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0233Mounting configuration of laser chips
02345Wire-bonding
H01S 5/02469
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02469Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
H01S 5/02476
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02476Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
H01S 5/02492
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02476Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
02492CuW heat spreaders
H01S 5/06226
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
062by varying the potential of the electrodes
06226Modulation at ultra-high frequencies
出願人
  • 三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP]/[JP]
発明者
  • 品田 卓郎 SHINADA, Takuro
代理人
  • 高田 守 TAKADA, Mamoru
  • 高橋 英樹 TAKAHASHI, Hideki
優先権情報
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) LIGHT MODULE
(FR) MODULE LUMINEUX
(JA) 光モジュール
要約
(EN)
The invention comprises a metal block, a first sub-mount fixed onto the metal block, and a second sub-mount having an upper surface and a lower surface, the lower surface being fixed via a metal layer onto the first sub-mount. The invention further comprises: an optical element mounted on the upper surface of the second sub-mount; and a high frequency line path formed on the upper surface of the second sub-mount, electrically connected to the optical element, thereby causing a signal such as a high-frequency signal to be input into or output from the optical element. The invention is characterized by the metal layer being electrically connected to the metal block.
(FR)
La présente invention comprend un bloc métallique, une première sous-monture fixée sur le bloc métallique, et une seconde sous-monture comportant une surface supérieure et une surface inférieure, la surface inférieure étant fixée par l'intermédiaire d'une couche métallique sur la première sous-monture. L'invention comprend en outre : un élément optique monté sur la surface supérieure de la seconde sous-monture ; et un chemin de ligne haute fréquence formé sur la surface supérieure de la seconde sous-monture, électriquement connecté à l'élément optique, amenant ainsi un signal tel qu'un signal haute fréquence à être appliqué dans l'élément optique ou à sortir de ce dernier. L'invention est caractérisée en ce que la couche métallique est électriquement connectée au bloc métallique.
(JA)
金属ブロックと、該金属ブロックに固定された第1サブマウントと、上面と下面を有し、該下面が金属層を介して該第1サブマウントに固定された第2サブマウントと、を備える。さらに、該第2サブマウントの該上面に搭載された光素子と、該第2サブマウントの該上面に形成され、該光素子と電気的に接続されることで高周波信号などの信号を該光素子に入力または出力する高周波線路と、を備える。そして、該金属層は該金属ブロックと電気的に接続されたことを特徴とする。
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