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1. US20200136345 - Light module

注意: このテキストは、OCR 処理によってテキスト化されたものです。法的な用途には PDF 版をご利用ください。

[ EN ]

Claims

1. A light module comprising:
a metal block;
a first sub-mount fixed to the metal block;
a second sub-mount having an upper surface and a lower surface, the lower surface being fixed to the first sub-mount via a metal layer;
an optical element mounted on the upper surface; and
a high frequency line path formed on the upper surface, wherein
the metal layer being electrically connected to the metal block.
2. The light module according to claim 1, comprising a through via that extends through the first sub-mount and electrically connects the metal layer to the metal block.
3. The light module according to claim 2, comprising a solder that joins the metal block to the first sub-mount, wherein
a material of the metal layer is solder.
4. The light module according to claim 3, wherein the first sub-mount and the second sub-mount are ceramic.
5. The light module according to claim 2, wherein the first sub-mount and the second sub-mount are ceramic.
6. The light module according to claim 2, wherein the second sub-mount is ceramic with a thickness of 0.05 mm or more and 0.2 mm or less.
7. The light module according to claim 1, comprising a metal unit that covers the first sub-mount, the metal unit being in contact with the metal layer and electrically connected to the metal block.
8. The light module according to claim 7, comprising a solder that joins the metal block to the first sub-mount, wherein
a material of the metal layer is solder.
9. The light module according to claim 8, wherein the first sub-mount and the second sub-mount are ceramic.
10. The light module according to claim 7, wherein the first sub-mount and the second sub-mount are ceramic.
11. The light module according to claim 7, wherein the second sub-mount is ceramic with a thickness of 0.05 mm or more and 0.2 mm or less.
12. The light module according to claim 1, comprising a wire that electrically connects the metal layer to the metal block.
13. The light module according to claim 12, comprising a solder that joins the metal block to the first sub-mount, wherein
a material of the metal layer is solder.
14. The light module according to claim 13, wherein the first sub-mount and the second sub-mount are ceramic.
15. The light module according to claim 12, wherein the first sub-mount and the second sub-mount are ceramic.
16. The light module according to claim 1, comprising a solder that joins the metal block to the first sub-mount, wherein
a material of the metal layer is solder.
17. The light module according to claim 16, wherein the first sub-mount and the second sub-mount are ceramic.
18. The light module according to claim 1, wherein the first sub-mount and the second sub-mount are ceramic.
19. The light module according to claim 1, wherein the second sub-mount is ceramic with a thickness of 0.05 mm or more and 0.2 mm or less.
20. The light module according to claim 1, wherein the second sub-mount is thinner than the first sub-mount.