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1. CN110651405 - LIGHT MODULE

官庁
中華人民共和国
出願番号 201780090696.3
出願日 17.05.2017
公開番号 110651405
公開日 03.01.2020
特許番号 110651405
特許付与日 11.06.2021
公報種別 B
IPC
H01S 5/02315
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
02レーザ作用にとって本質的ではない構造的な細部または構成
022マウント;ハウジング
023マウント部材,例.サブマウント部材
02315支持部材,例.ベース,キャリア
H01S 5/024
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
02レーザ作用にとって本質的ではない構造的な細部または構成
024冷却装置
CPC
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01S 5/02476
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02476Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
H01S 5/02492
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02476Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
02492CuW heat spreaders
H01S 5/06226
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
062by varying the potential of the electrodes
06226Modulation at ultra-high frequencies
H01S 5/02345
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0233Mounting configuration of laser chips
02345Wire-bonding
H01S 5/02469
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02469Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
出願人 MITSUBISHI ELECTRIC CORPORATION
三菱电机株式会社
発明者 SHINADA TAKURO
品田卓郎
代理人 北京天昊联合知识产权代理有限公司 11112
北京天昊联合知识产权代理有限公司 11112
発明の名称
(EN) LIGHT MODULE
(ZH) 光模块
要約
(EN)
The invention comprises a metal block, a first sub-mount fixed onto the metal block, and a second sub-mount having an upper surface and a lower surface, the lower surface being fixed via a metal layeronto the first sub-mount. The invention further comprises: an optical element mounted on the upper surface of the second sub-mount; and a high frequency line path formed on the upper surface of the second sub-mount, electrically connected to the optical element, thereby causing a signal such as a high-frequency signal to be input into or output from the optical element. The invention is characterized by the metal layer being electrically connected to the metal block.

(ZH)
具备:金属块;第1载体,其固定于该金属块;以及第2载体,其具有上表面和下表面,该下表面经由金属层固定于该第1载体。并且,具备:光元件,其搭载于该第2载体的该上表面;以及高频线路,其形成于该第2载体的该上表面,与该光元件电连接,由此,将高频信号等信号向该光元件输入或者从该光元件输出。而且,特征在于,该金属层与该金属块电连接。

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