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1. IL243474 - COMBINED X-RAY AND OPTICAL METROLOGY

Office Israël
Numéro de la demande 243474
Date de la demande 06.01.2016
Numéro de publication 243474
Date de publication 28.02.2019
Numéro de délivrance 243474
Date de délivrance 28.02.2019
Type de publication B
CIB
G01B 15/00
GPHYSIQUE
01MÉTROLOGIE; TESTS
BMESURE DE LA LONGUEUR, DE L'ÉPAISSEUR OU DE DIMENSIONS LINÉAIRES ANALOGUES; MESURE DES ANGLES; MESURE DES SUPERFICIES; MESURE DES IRRÉGULARITÉS DES SURFACES OU CONTOURS
15Dispositions pour la mesure caractérisées par l'utilisation de radiations d'ondes ou de particules
G01N 23/2206
GPHYSIQUE
01MÉTROLOGIE; TESTS
NRECHERCHE OU ANALYSE DES MATÉRIAUX PAR DÉTERMINATION DE LEURS PROPRIÉTÉS CHIMIQUES OU PHYSIQUES
23Recherche ou analyse des matériaux par l'utilisation de rayonnement (ondes ou particules), p.ex. rayons X ou neutrons, non couvertes par les groupes G01N3/-G01N17/201
22en mesurant l'émission secondaire de matériaux
2206Combinaison de plusieurs mesures, l'une au moins étant celle d’une émission secondaire, p.ex. combinaison d’une mesure d’électrons secondaires et d’électrons rétrodiffusés
H01L 21/66
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
66Test ou mesure durant la fabrication ou le traitement
CPC
G01B 2210/56
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
2210Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
G01N 23/2206
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
23Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00G01N17/00, G01N21/00 or G01N22/00
22by measuring secondary emission from the material
2206Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement
H01L 22/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
10Measuring as part of the manufacturing process
12for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
H01L 22/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
G01B 15/00
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
15Measuring arrangements characterised by the use of wave or particle radiation
G01N 23/203
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
23Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00G01N17/00, G01N21/00 or G01N22/00
20by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
203Measuring back scattering
Déposants KLA-TENCOR CORPORATION
Mandataires SANFORD T.COLB & CO.
סנפורד ט. קולב ושות'
Données relatives à la priorité 14/074,689 07.11.2013 US
61/843,868 08.07.2013 US
61/867,363 19.08.2013 US
Titre
(EN) COMBINED X-RAY AND OPTICAL METROLOGY
(HE) מטרולוגיה משלבת קרני–X ואופטיקה
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