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1. CN108738235 - Production method of circuit board with mechanical blind holes

Office Chine
Numéro de la demande 201810494165.7
Date de la demande 22.05.2018
Numéro de publication 108738235
Date de publication 02.11.2018
Type de publication A
CIB
H05K 3/00
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
3Appareils ou procédés pour la fabrication de circuits imprimés
CPC
H05K 3/0047
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0011Working of insulating substrates or insulating layers
0044Mechanical working of the substrate, e.g. drilling or punching
0047Drilling of holes
Déposants VICTORY GIANT TECHNOLOGY (HUIZHOU) CO., LTD.
胜宏科技(惠州)股份有限公司
Inventeurs LI XIONGJIE
李雄杰
ZHOU DINGZHONG
周定忠
ZHAO QIXIANG
赵启祥
SHI SHIKUN
施世坤
Mandataires 惠州创联专利代理事务所(普通合伙) 44382
Titre
(EN) Production method of circuit board with mechanical blind holes
(ZH) 一种机械盲孔线路板制作方法
Abrégé
(EN)
The invention provides a production method of a circuit board with mechanical blind holes. The method comprises the steps of selecting a first double-sided board and a second double-sided board; arranging an L1 layer and an L2 layer on both sides of copper layers on the first double-sided board separately; arranging an L3 layer and an L4 layer on both sides of copper layers on the second double-sided board separately; drilling through holes in the first double-sided board and the second double-sided board by adopting a mechanical drilling mode according to the design positions and apertures ofthe blind holes in the circuit board; sequentially carrying out hole copper plating, resin hole plugging and resin grinding on the first double-sided board and the second double-sided board; protecting the L1 layer and the L4 layer by using dry films and then producing circuits on the L2 layer and the L3 layer separately; and taking the L1 layer on the first double-sided board as a top layer of the circuit board, taking the L4 layer on the second double-sided board as a bottom layer of the circuit board and arranging a PP layer between the first double-sided board and the second double-sidedboard for lamination or arranging one or more substrates subjected to circuit production between the first double-sided board and the second double-sided board for lamination to form an overall circuit board.

(ZH)
本发明提供的一种机械盲孔线路板制作方法,包括:选用第一双面板、第二双面板;第一双面板上的两面铜层分别设为L1层,L2层;第二双面板上的两面铜层分别设为L3层、L4层;按线路板上的盲孔设计位置及孔径,在第一双面板及第二双面板上采用机械钻孔方式钻通孔;在第一双面板及第二双面板上依次进行镀孔铜、树脂塞孔、树脂研磨;将L1层和L4层用干膜保护,然后分别在L2层和L3层上制作线路;将第一双面板的L1层作为线路板的顶层,将第二双面板的L4层作为线路板的底层,在第一双面板和第二双面板之间设置PP层进行压合,或将一块或多块完成线路制作的基板设置于第一双面板和第二双面板之间进行压合,形成一线路板整体。