Traitement en cours

Veuillez attendre...

Paramétrages

Paramétrages

Aller à Demande

1. CN108594017 - Bonding impedance detecting system and method

Office Chine
Numéro de la demande 201810707417.X
Date de la demande 02.07.2018
Numéro de publication 108594017
Date de publication 28.09.2018
Type de publication A
CIB
G01R 27/02
GPHYSIQUE
01MÉTROLOGIE; TESTS
RMESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES
27Dispositions pour procéder aux mesures de résistance, de réactance, d'impédance, ou de caractéristiques électriques qui en dérivent
02Mesure de résistances, de réactances, d'impédances réelles ou complexes, ou autres caractéristiques bipolaires qui en dérivent, p.ex. constante de temps
CPC
G01R 27/02
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
27Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
Déposants BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
北京京东方显示技术有限公司
Inventeurs ZHANG BIN
张斌
CHEN PENGMING
陈鹏名
XU WENPENG
许文鹏
Mandataires 北京天昊联合知识产权代理有限公司 11112
北京天昊联合知识产权代理有限公司 11112
Titre
(EN) Bonding impedance detecting system and method
(ZH) 一种邦定阻抗检测系统及方法
Abrégé
(EN)
The invention discloses a bonding impedance detecting system and method. The bonding impedance detecting system comprises a bonding impedance detecting module, a display panel, a chip-on-film and a circuit board, wherein the chip-on-film is connected with the circuit board through a plurality of bonding pad groups; the chip-on-film is connected with the display panel through a plurality of bondingpad groups; each bonding pad group comprises two bonding pads which are connected; part of the bonding pad groups and a first equivalent resistor connected with the part of the bonding pad groups form a detecting structure; the detecting structure is connected with a bonding impedance detecting module; and the bonding impedance detecting module is used for detecting the bonding impedance of the bonding pad groups and the uniformity of the bonding impedance of the bonding pad groups. The bonding impedance of a display screen and the uniformity of the bonding impedance can be detected, and influences of bonding impedance abnormity to the display effect of the display screen are reduced effectively.

(ZH)
本发明公开了一种邦定阻抗检测系统及方法,该邦定阻抗检测系统包括邦定阻抗检测模块、显示面板、覆晶薄膜和电路板,所述覆晶薄膜和所述电路板通过多个邦定焊盘组连接,所述覆晶薄膜和所述显示面板通过多个邦定焊盘组连接,邦定焊盘组包括两个相连的邦定焊盘,部分所述邦定焊盘组与连接的第一等效电阻形成检测结构,所述检测结构连接至所述邦定阻抗检测模块,所述邦定阻抗检测模块用于根据所述检测结构检测出所述邦定焊盘组的邦定阻抗和所述邦定焊盘组的邦定阻抗的均一性。本发明能够检测显示屏的邦定阻抗及邦定阻抗的均一性,有效减少邦定阻抗异常对显示屏的显示效果的影响。