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1. CN106559960 - Double-side stepped hole circuit board and implementation method therefor

Office Chine
Numéro de la demande 201510632500.1
Date de la demande 29.09.2015
Numéro de publication 106559960
Date de publication 05.04.2017
Type de publication A
CIB
H05K 3/42
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
3Appareils ou procédés pour la fabrication de circuits imprimés
40Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
42Trous de passage métallisés
CPC
H05K 3/42
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
H05K 3/421
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
421Blind plated via connections
H05K 2201/09509
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09509Blind vias, i.e. vias having one side closed
H05K 2201/09845
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
09845Stepped hole, via, edge, bump or conductor
H05K 3/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
Déposants ZTE CORPORATION
Inventeurs WEI XINQI
MIAO YU
WANG YU
YANG SHANMING
Titre
(EN) Double-side stepped hole circuit board and implementation method therefor
(ZH) 双面阶梯孔电路板及其实现方法
Abrégé
(EN)
The invention discloses a double-side stepped hole circuit board implementation method, and the method comprises the following steps: manufacturing a circuit board with an upper blind hole and a lower blind hole; carrying out the compressing of copper foil on the upper and lower surfaces of the circuit board so as to cover the mouths of the upper and lower blind holes; drilling through holes in a plurality of rows on the circuit board, and carrying out the copper deposition electroplating of the through holes; carrying out the back drilling of a row of through holes near to the blind holes, removing the copper foil, and forming a stepped hole region, in which the blind hole surface and the surfaces of the row of through holes close to the blind holes and the surfaces of other through holes are stepped, on the circuit board. In addition, the invention also discloses a double-side stepped hole circuit board structure. According to the invention, the two surfaces of the circuit board are respectively provided with a stepped hole region, wherein each stepped hole region comprises the through holes and the blind holes. The circuit board can meet the demands of a connector with through holes and blind holes at the same time, and solves a small-interval crimping problem. The blind holes cannot hide liquid medicine, and the back drill holes achieves the high-speed connection of the circuit board, thereby enabling the circuit board to be higher in integration degree and reliability, and effectively reducing the thickness of the circuit board.

(ZH)
本发明公开了一种双面阶梯孔电路板实现方法,其包括如下步骤:制成具有上层盲孔和下层盲孔的电路板;在电路板上下表面压制铜箔,覆盖上层盲孔和下层盲孔的孔口;在电路板上钻出多排通孔,并对通孔进行沉铜电镀;对靠近盲孔的一排通孔进行背钻,去除铜箔,在电路板上形成其盲孔表面及靠近盲孔的一排通孔表面与其他通孔表面为阶梯状的阶梯孔区域;此外,本发明还公开一种双面阶梯孔电路板结构。本发明的电路板,其双面均分布阶梯孔区域,阶梯孔区域包括通孔和盲孔,可以满足同时具有通孔和盲孔的连接器的需求,解决密间距压接问题,盲孔不会隐藏药水,背钻孔实现电路板的高速连接,使得电路板具有更高的集成度、可靠性,有效减少电路板的厚度。