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1. CN101640983 - Processing method of printing circuit board blind hole

Office Chine
Numéro de la demande 200910306850.3
Date de la demande 10.09.2009
Numéro de publication 101640983
Date de publication 03.02.2010
Numéro de délivrance 101640983
Date de délivrance 19.01.2011
Type de publication B
CIB
H05K 3/42
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
3Appareils ou procédés pour la fabrication de circuits imprimés
40Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
42Trous de passage métallisés
CPC
H05K 3/4623
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
4623the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
H05K 3/0047
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0011Working of insulating substrates or insulating layers
0044Mechanical working of the substrate, e.g. drilling or punching
0047Drilling of holes
H05K 3/0094
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
H05K 3/429
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
H05K 2201/09536
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09536Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
H05K 2203/1152
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
11Treatments characterised by their effect, e.g. heating, cooling, roughening
1152Replicating the surface structure of a sacrificial layer, e.g. for roughening
Déposants Shenzhen Shennan Circuits Co., Ltd.
深南电路有限公司
Inventeurs Peng Qinwei
彭勤卫
Cui Rong
崔荣
Xiong Jia
熊佳
Mandataires shang zhendong
深圳市维邦知识产权事务所 44269
Titre
(EN) Processing method of printing circuit board blind hole
(ZH) 印刷电路板盲孔的加工方法
Abrégé
(EN)
The invention relates to a processing method of a printing circuit board blind hole, comprising the following processing steps: a plurality of through holes are respectively drilled on each daughter board, copper is respectively plated on the inner wall of each through hole and then a circuit and a welding disc are etched on each daughter board; a semi-curing plate is respectively bonded on each daughter board and holes are processed on the semi-curing plate positioned on the top surface of each daughter board; the semi-curing plate positioned on the bottom surface of each daughter board covers the whole bottom surface of the daughter board; a copper foil is respectively bonded on the semi-curing plates on the bottom surface and the top surface of each daughter board, the daughter boards bonded with the semi-curing plate are laminated under high temperature; the copper foil of the semi-curing plate at the position of the bottom surface of each daughter board is removed, a gummosis semi-curing plate is arranged between the bottom surfaces of the two daughter boards and the two daughter boards are laminated into one body by the gummosis semi-curing plate; a long through hole is formed by processing the daughter by hole drilling, copper precipitation, electroplating and graphic production; and the copper foil at the outer side of the printing circuit board is removed to form the blind hole. The processing method does not have residual chemicals in the deep blind hole and the hole wall is not corroded.

(ZH)

一种印刷电路板盲孔的加工方法,包括以下加工步骤:在每块子板上分别钻出多个通孔,在每个通孔内壁上分别镀铜,然后在每块子板上蚀刻出线路和焊盘;在每块子板的上分别粘合半固化片,在位于每块子板顶面的半固化片上加工孔;位于每块子板底面的半固化片覆盖整个子板底面;在每块子板底面和顶面上的半固化片上分别粘合铜箔,且对每块粘合有半固化片的子板进行高温压合;拆除每块子板底面处的半固化片的铜箔,在两块子板底面之间设置流胶半固化片,通过流胶半固化片把两块子板的底面相对压合为一体;对子板进行钻孔、沉铜、电镀和图形制作形成长通孔;拆除印刷电路板外侧的铜箔形成盲孔;本发明在深度盲孔内不会残留化学药品,且孔壁不会产生腐蚀。