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1. CN101601131 - Structure for mounting semiconductor package

Office Chine
Numéro de la demande 200780050947.1
Date de la demande 30.11.2007
Numéro de publication 101601131
Date de publication 09.12.2009
Type de publication A
CIB
H01L 23/40
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
23Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
34Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
40Supports ou moyens de fixation pour les dispositifs de refroidissement ou de chauffage amovibles
CPC
H01L 23/3677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
3677Wire-like or pin-like cooling fins or heat sinks
H01L 23/4093
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4093Snap-on arrangements, e.g. clips
H01L 2224/0554
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
H01L 2224/05568
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
0556Disposition
05568the whole external layer protruding from the surface
H01L 2224/05573
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
05573Single external layer
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
Déposants Nippon Electric Co.
日本电气株式会社
Inventeurs Sasaki Junichi
佐佐木纯一
Hino Tomoyuki
樋野智之
Mandataires song he nan ting
北京东方亿思知识产权代理有限责任公司
北京东方亿思知识产权代理有限责任公司
Données relatives à la priorité 035101/2007 15.02.2007 JP
Titre
(EN) Structure for mounting semiconductor package
(ZH) 用于安装半导体封装的结构
Abrégé
(EN)
In a mounting structure, a semiconductor package (1) and a heat sink (8) for dissipating heat generated from the semiconductor package (1) are mounted on a mounting board (3). The rear surface of the semiconductor package (1) is bonded to the front surface of the mounting board (3) facing the rear surface. The heat sink (8) is brought into contact with the rear surface of the semiconductor package (1) through a through hole (5) formed on the mounting substrate (3). The semiconductor package (1) and the heat sink (8) are pressed to each other by an elastic force of a clip (6).

(ZH)

一种安装结构,其中半导体封装(1)和用于散发从半导体封装(1)生成的热量的热沉(8)被安装在安装板(3)上。半导体封装(1)的后表面接合到安装板(3)的面向该后表面的前表面上。使热沉(8)经由安装板(3)上形成的通孔(5)与半导体封装(1)的后表面接触。半导体封装(1)和热沉(8)被夹(6)的弹性力互相压着。

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