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1. WO2020198235 - CONFIGURATIONS DE MONTAGE POUR COMPOSANTS OPTOÉLECTRONIQUES DANS DES SYSTÈMES LIDAR

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

WHAT IS CLAIMED IS:

1. A LiDAR system comprising:

a first optical lens characterized by a first optical axis, a first lens center, and a first surface of best focus;

one or more first optoelectronic packages spaced apart from the first optical lens along the first optical axis, each respective first optoelectronic package comprising a first plurality of optoelectronic components positioned on the respective first optoelectronic package such that a surface of each respective optoelectronic component of the first plurality of optoelectronic components lies substantially on the first surface of best focus;

a second optical lens characterized by a second optical axis, a second lens center, and a second surface of best focus; and

one or more second optoelectronic packages spaced apart from the second optical lens along the second optical axis, each respective second optoelectronic package comprising a second plurality of optoelectronic components positioned on the respective second optoelectronic package such that a surface of each respective optoelectronic component of the second plurality of optoelectronic components lies substantially on the second surface of best focus.

2. The LiDAR system of claim 1 wherein each of the first surface of best focus and the second surface of best focus is curved.

3. The LiDAR system of claim 1 wherein:

the first plurality of optoelectronic components is positioned on the respective first optoelectronic package such that each respective optoelectronic component of the first plurality of optoelectronic components is oriented substantially toward the first lens center; and

the second plurality of optoelectronic components is positioned on the respective second optoelectronic package such that each respective optoelectronic component of the second plurality of optoelectronic components is oriented substantially toward the second lens center.

4. The LiDAR system of claim 1 wherein each respective first optoelectronic package comprises a first surface mount device (SMD) package, and each respective second optoelectronic package comprises a second SMD.

5. The LiDAR system of claim 4 further comprising a first printed circuit board (PCB) and a second PCB, wherein the one or more first optoelectronic packages are mechanically and electrically coupled to the first printed circuit board (PCB), and the one or more second optoelectronic packages are mechanically and electrically coupled to the second PCB.

6. The LiDAR system of claim 5 wherein the first PCB has a first curved surface on which the one or more first optoelectronic packages are mounted, and the second PCB has a second curved surface on which the one or more second optoelectronic packages are mounted.

7. The LiDAR system of claim 4 further comprising a printed circuit board (PCB), wherein the one or more first optoelectronic packages and the one or more second optoelectronic packages are mechanically and electrically coupled to the PCB.

8. The LiDAR system of claim 4 wherein the one or more first optoelectronic packages comprise a plurality of first optoelectronic packages, and the one or more second optoelectronic packages comprise a plurality of second optoelectronic packages, the LiDAR system further comprising:

a first interposer having a first plurality of facets, wherein the plurality of first optoelectronic packages is mounted on the first interposer, each respective first optoelectronic package being disposed on a respective facet of the first plurality of facets; and

a second interposer having a second plurality of facets, wherein the plurality of second optoelectronic packages is mounted on the second interposer, each respective second optoelectronic package being disposed on a respective facet of the second plurality of facets.

9. The LiDAR system of claim 8 further comprising one or more planar printed circuit boards (PCBs), wherein the first interposer and the second interposer are mounted on the one or more planar PCBs.

10. The LiDAR system of claim 1 wherein:

the first plurality of optoelectronic components includes a first plurality of light sources; and

the second plurality of optoelectronic components includes a second plurality of detectors.

11. The LiDAR system of claim 1 wherein:

the first plurality of optoelectronic components includes a first set of light sources and a first set of detectors; and

the second plurality of optoelectronic components includes a second set of light sources and a second set of detectors.

12. An optoelectronic package for a LiDAR system, the LiDAR system including an optical lens characterized by an optical axis, a lens center, and a surface of best focus, the optoelectronic package comprising:

a substrate spaced apart from the optical lens along the optical axis; and a plurality of optoelectronic components positioned on the substrate such that a surface of each respective optoelectronic component lies substantially on the surface of best focus of the optical lens.

13. The optoelectronic package of claim 12 wherein each of the first surface of best focus and the second surface of best focus is curved.

14. The optoelectronic package of claim 12 wherein each respective optoelectronic component is positioned on the substrate such that the respective

optoelectronic component is oriented substantially toward the lens center.

15. The optoelectronic package of claim 12 being configured as a surface mount device (SMD) package for mechanically and electrically coupling to a printed circuit board (PCB).

16. The optoelectronic package of claim 12 wherein the plurality of optoelectronic components includes a plurality of light sources or a plurality of detectors.

17. The optoelectronic package of claim 12 wherein the plurality of optoelectronic components includes a set of light sources and a set of detectors.

18. The optoelectronic package of claim 12 wherein the substrate has a surface characterized by a plurality of facets, each respective optoelectronic component being positioned on a respective facet of the plurality of facets.

19. An optoelectronic package for a LiDAR system, the LiDAR system including an optical lens characterized by an optical axis, a lens center, and a surface of best focus, the optoelectronic package comprising:

a substrate spaced apart from the optical lens along the optical axis; and a plurality of optoelectronic components positioned on the substrate such that each respective optoelectronic component is oriented substantially toward the lens center.

20. The optoelectronic package of claim 19 being configured as a surface mount device (SMD) package for mechanically and electrically coupling to a printed circuit board (PCB).

21. The optoelectronic package of claim 19 wherein the plurality of optoelectronic components includes a plurality of light sources or a plurality of detectors.

22. The optoelectronic package of claim 19 wherein the plurality of optoelectronic components includes a set of light sources and a set of detectors.

23. The optoelectronic package of claim 22 wherein the substrate has a top surface and a side surface, and wherein the set of light sources is disposed on the side surface, and the set of detectors is disposed on the top surface.