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1. WO2020109614 - PROCÉDÉ ET DISPOSITIF DE CRÉATION D'AU MOINS UNE PARTIE D'UN CIRCUIT ÉLECTRONIQUE, ET CIRCUIT ÉLECTRONIQUE

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[ EN ]

CLAIMS

1. Method of creating at least a part of an electronic circuit, comprising the steps of:

A) providing at least one carbonizable substrate, in particular a cellulose based substrate, B) position-selectively irradiating at least one part of the substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad.

2. Method according to claim 1 , wherein step B) is repeated a plurality of times, such that at least one irradiated part of the substrate is irradiated a plurality of times.

3. Method according to claim 1 or 2, wherein step B) is repeated a plurality of times, such that the at least one irradiated part of the substrate is irradiated two or three times.

4. Method according to one of the foregoing claims, wherein the method comprises step C), comprising of applying mechanical pressure onto at least one irradiated part of the substrate to compact at least one electrically conductive track and/or pad.

5. Method according to claim 4, wherein the mechanical pressure applied exceeds to the elastic limit of the substrate.

6. Method according to claim 4 or 5, wherein step C) is repeated a plurality of times, such that at least one irradiated part of the substrate is mechanically pressed a plurality of times.

7. Method according to one of claims 4-6, wherein step C) is repeated a plurality of times, such that at least one irradiated part of the substrate is mechanically pressed at least five times.

8. Method according to one of claims 2-3 and one of claims 4-7, wherein the sequence of step B) and

C) is executed a plurality of times.

9. Method according to one of claims 4-8, wherein the exerted mechanical pressure is at least 6 kPa, preferably at least 10 kPa.

10. Method according to one of claims 4-9, wherein during step C) the substrate thickness is reduced at least partially and/or wherein during step C) the thickness

of at least one electrically conductive track and/or pad is reduced.

1 1. Method according to one of claim 4-10, wherein the mechanical pressure is applied by using at least one roller.

12. Method according to one of claim 11 , wherein during step C) an irradiated side of the substrate is firstly covered by at least one covering layer prior to applying mechanical pressure by said at least one roller.

13. Method according to one of claim 12, wherein during step C) an irradiated side of the substrate is firstly covered by at least one non-stick foil, such as a metal foil, in particular an aluminium foil.

14. Method according to one of claim 13, wherein the at least one non-stick foil, such as a metal foil, in particular an aluminium foil, is covered by a flexible foil, in particular a polytetrafluoroethylene (Teflon) foil prior to applying mechanical pressure by said at least one roller.

15. Method according to one of claims 1 1 -14, wherein the irradiated substrate is fed through a space formed in between at least one top roller, acting on an irradiated side of the substrate and/or at least one covering layer covering said irradiated side of the substrate, and at least one bottom roller acting on an opposite side of the substrate.

16. Method according to one of the foregoing claims, wherein during step B) a part of the substrate is position-selectively irradiated for a period of time situated in between 0 and 5 seconds.

17. Method according to one of the foregoing claims, wherein during step B) a part of the substrate is position-selectively irradiated by using at least one irradiation source, preferably a laser, and more preferably a C0 laser.

18. Method according to claim 17, wherein during step B) the substrate and the at least one irradiation source, preferably a laser, and more preferably a C02 laser, are mutually displaced by using a speed which is at least 10 mm/s.

19. Method according to one of the foregoing claims, wherein the method comprises step E), comprising of preheating the substrate, preferably to a temperature situated in between 200 and 250 degrees Celsius, prior to performing step B).

20. Method according to one of the foregoing claims, wherein the method comprises step F), comprising of post-irradiating at least the irradiated parts of the substrate after completion of step B), preferably by using at least one laser selected from the group consisting of: a blue laser, a green laser, a blue-green laser.

21. Method according to one of the foregoing claims, wherein during step B) the temperature of the at least one irradiated part of substrate is brought to at least 400 degrees Celsius.

22. Method according to one of the foregoing claims, wherein the substrate is formed by paper and/or carton.

23. Method according to one of the foregoing claims, wherein at least one electrically conductive track created during step B) is a linear track, preferably extending parallel to a plane defined by the substrate. 24. Method according to one of the foregoing claims, wherein at least one electrically conductive track created during step B) is a non-linear track, preferably extending parallel to a plane defined by the substrate.

25. Method according to one of the foregoing claims, wherein during step B) a plurality of electrically conductive tracks and/or pads are created which are mutually connected.

26. Method according to one of the foregoing claims, wherein the method comprises step D), comprising attaching at least one electric component to the substrate, wherein said electric component is connected to at least one electrically conductive track and/or pad created during step B).

27. Method according to one of the foregoing claims, wherein during step A) a plurality of the carbonizable substrates is provided, wherein onto each substrate at least one electrically conductive track and/or pad is created, and wherein the method comprises step E) comprising of stacking of a plurality of irradiated substrates on top of each other, preferably such that at least one three-dimensional track and/or pad is formed extending through said stacked substrates.

28. Method according to one of the foregoing claims, wherein during step B) at least one position-selective part of the substrate is irradiated such that the at least one formed carbonized track and/or pad extends from a top side of the substrate to a rear side of the substrate.

29. Method according to one of the foregoing claims, wherein the method comprises step G), comprising the step of increasing the bond strength between at least one electrically conductive track and/or pad printed and/or to be printed during step B) and the substrate.

30. Device for creating at least a part of an electronic circuit, by using the method according to one of the preceding claims, comprising: at least one irradiation source, in particular a laser, such as a C0 laser, being configured to position-selectively irradiate at least one part of a carbonizable substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad.

31. Electronic circuit, or at least a part thereof, created by applying the method according to one claims