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1. WO2020094320 - MODULE ELECTRONIQUE POUR CARTE A PUCE

Numéro de publication WO/2020/094320
Date de publication 14.05.2020
N° de la demande internationale PCT/EP2019/077275
Date du dépôt international 09.10.2019
CIB
G06K 19/077 2006.01
GPHYSIQUE
06CALCUL; COMPTAGE
KRECONNAISSANCE DES DONNÉES; PRÉSENTATION DES DONNÉES; SUPPORTS D'ENREGISTREMENT; MANIPULATION DES SUPPORTS D'ENREGISTREMENT
19Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques
06caractérisés par le genre de marque numérique, p.ex. forme, nature, code
067Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit
07avec des puces à circuit intégré
077Détails de structure, p.ex. montage de circuits dans le support
CPC
G06K 19/07745
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07745Mounting details of integrated circuit chips
G06K 19/0775
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
0775arrangements for connecting the integrated circuit to the antenna
G06K 19/07754
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
0775arrangements for connecting the integrated circuit to the antenna
07754the connection being galvanic
G06K 19/07769
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
07766comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
07769the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
G06K 19/07775
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
07773Antenna details
07775the antenna being on-chip
Déposants
  • SMART PACKAGING SOLUTIONS [FR]/[FR]
Inventeurs
  • CALVA, Bernard
  • VOLPE, Pierre
Mandataires
  • DUDOUIT, Isabelle
  • LUCAS, Laurent
Données relatives à la priorité
186029708.11.2018FR
Langue de publication français (FR)
Langue de dépôt français (FR)
États désignés
Titre
(EN) ELECTRONIC MODULE FOR CHIP CARD
(FR) MODULE ELECTRONIQUE POUR CARTE A PUCE
Abrégé
(EN)
Process for producing an electronic module that is intended for implementation in a dual portable object, characterized in that it includes at least the following steps: • Using a single-sided film (4) consisting of one or more contact zones (3) and a dielectric comprising one or more openings; • Using a substrate (6) comprising one or more electrically conductive zones that are intended for the contactless communication of the object; • Fixing said single-side film (4) and said substrate (6) together; • Positioning an integrated circuit (20) and connecting it to the contact zones (3) of the single-sided film and at least one terminal of at least one of said electrically conductive zones; • Depositing a protective layer (21) surrounding at least said integrated circuit. Module obtained by means of the process.
(FR)
Procédé de fabrication d’un module électronique destiné à être implémenté dans un objet portatif dual caractérisé en ce qu’il comporte au moins les étapes suivantes : • Utiliser un film simple face (4) constitué par une ou plusieurs zones de contacts (3) et un diélectrique comprenant un ou plusieurs orifices, • Utiliser un substrat (6) comprenant une ou plusieurs zones électriquement conductrices destinées à la communication sans contact de l’objet, • Solidariser ledit film simple face (4) et ledit substrat (6), • Positionner un circuit intégré (20) et le connecter aux zones de contacts (3) du film simple face et au moins à une borne d’au moins une desdites zones électriquement conductrices, • Déposer une couche de protection (21) englobant au moins ledit circuit intégré. Module obtenu par le procédé.
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