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1. WO2020069829 - PROCÉDÉ POUR LE CHAUFFAGE INTERNE DE LIAISONS ÉPOXY

Numéro de publication WO/2020/069829
Date de publication 09.04.2020
N° de la demande internationale PCT/EP2019/074176
Date du dépôt international 11.09.2019
CIB
F16B 11/00 2006.01
FMÉCANIQUE; ÉCLAIRAGE; CHAUFFAGE; ARMEMENT; SAUTAGE
16ÉLÉMENTS OU ENSEMBLES DE TECHNOLOGIE; MESURES GÉNÉRALES POUR ASSURER LE BON FONCTIONNEMENT DES MACHINES OU INSTALLATIONS; ISOLATION THERMIQUE EN GÉNÉRAL
BDISPOSITIFS POUR ASSEMBLER OU BLOQUER LES ÉLÉMENTS DE CONSTRUCTION OU LES PARTIES DE MACHINES, p.ex. CLOUS, CHEVILLES, ÉCROUS, VIS, BOULONS, BAGUES ANNULAIRES FORMANT RESSORT, BRIDES OU COLLIERS, CLIPS OU PINCES, COINS; ASSEMBLAGES OU JOINTURES
11Assemblage d'éléments structuraux ou parties de machines par collage ou en les pressant l'un contre l'autre, p.ex. soudage sous pression à froid
B32B 37/12 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
32PRODUITS STRATIFIÉS
BPRODUITS STRATIFIÉS, c. à d. FAITS DE PLUSIEURS COUCHES DE FORME PLANE OU NON PLANE, p.ex. CELLULAIRE OU EN NID D'ABEILLES
37Procédés ou dispositifs pour la stratification, p.ex. par polymérisation ou par liaison à l'aide d'ultrasons
12caractérisés par l'usage d'adhésifs
CPC
B32B 37/1207
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
12characterised by using adhesives
1207Heat-activated adhesive
F16B 11/006
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
BDEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS, WEDGES, JOINTS OR JOINTING
11Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
006by gluing
G03F 7/70716
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70691Handling of masks or wafers
70716Stages
G03F 7/70808
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
G03F 7/7095
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
7095Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
Déposants
  • ASML HOLDING N.V. [NL]/[NL]
Inventeurs
  • BURROUGHS, John, Robert
  • JAGATIA, Bhavi
  • GRIFFING, Charles, Hudson, III
Mandataires
  • SLENDERS, Petrus Johannes Waltherus
Données relatives à la priorité
62/742,00905.10.2018US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) METHOD FOR INTERNAL HEATING OF EPOXY BONDS
(FR) PROCÉDÉ POUR LE CHAUFFAGE INTERNE DE LIAISONS ÉPOXY
Abrégé
(EN)
A bonding apparatus (200) includes a first substrate (202), a second substrate (204), a bonding layer (206), and a heating element (300). The bonding layer (206) is disposed between the first and second substrates (202, 204). The bonding layer (206) is configured to bond the first and second substrates (202, 204) together. The heating element (300) is disposed between the first and second substrates (202, 204) and contacts the bonding layer (206). The heating element (300) is configured to generate localized resistive heating to bond the first and second substrates (202, 204) together or to debond the first and second substrates (202, 204) apart.
(FR)
L'invention concerne un appareil de liaison (200) comprenant un premier substrat (202), un second substrat (204), une couche de liaison (206) et un élément chauffant (300). La couche de liaison (206) est disposée entre les premier et second substrats (202, 204). La couche de liaison (206) est conçue pour lier ensemble les premier et second substrats (202, 204). L'élément chauffant (300) est disposé entre les premier et second substrats (202, 204) et entre en contact avec la couche de liaison (206). L'élément chauffant (300) est conçu pour générer un chauffage résistif localisé pour lier ensemble les premier et second substrats (202, 204) ou pour décoller les premier et second substrats (202, 204).
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