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1. WO2017060656 - PROCEDE DE GREFFAGE DE FILM MINCE POLYMERIQUE SUR SUBSTRAT ET PROCEDE DE METALLISATION DE CE FILM MINCE

Numéro de publication WO/2017/060656
Date de publication 13.04.2017
N° de la demande internationale PCT/FR2016/052605
Date du dépôt international 07.10.2016
CIB
B05D 1/18 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
05PULVÉRISATION OU ATOMISATION EN GÉNÉRAL; APPLICATION DE LIQUIDES OU D'AUTRES MATÉRIAUX FLUIDES AUX SURFACES, EN GÉNÉRAL
DPROCÉDÉS POUR APPLIQUER DES LIQUIDES OU D'AUTRES MATÉRIAUX FLUIDES AUX SURFACES, EN GÉNÉRAL
1Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces
18par immersion
C23C 18/18 2006.01
CCHIMIE; MÉTALLURGIE
23REVÊTEMENT DE MATÉRIAUX MÉTALLIQUES; REVÊTEMENT DE MATÉRIAUX AVEC DES MATÉRIAUX MÉTALLIQUES; TRAITEMENT CHIMIQUE DE SURFACE; TRAITEMENT DE DIFFUSION DE MATÉRIAUX MÉTALLIQUES; REVÊTEMENT PAR ÉVAPORATION SOUS VIDE, PAR PULVÉRISATION CATHODIQUE, PAR IMPLANTATION D'IONS OU PAR DÉPÔT CHIMIQUE EN PHASE VAPEUR, EN GÉNÉRAL; MOYENS POUR EMPÊCHER LA CORROSION DES MATÉRIAUX MÉTALLIQUES, L'ENTARTRAGE OU LES INCRUSTATIONS, EN GÉNÉRAL
CREVÊTEMENT DE MATÉRIAUX MÉTALLIQUES; REVÊTEMENT DE MATÉRIAUX AVEC DES MATÉRIAUX MÉTALLIQUES; TRAITEMENT DE SURFACE DE MATÉRIAUX MÉTALLIQUES PAR DIFFUSION DANS LA SURFACE, PAR CONVERSION CHIMIQUE OU SUBSTITUTION; REVÊTEMENT PAR ÉVAPORATION SOUS VIDE, PAR PULVÉRISATION CATHODIQUE, PAR IMPLANTATION D'IONS OU PAR DÉPÔT CHIMIQUE EN PHASE VAPEUR, EN GÉNÉRAL
18Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement; Dépôt par contact
16par réduction ou par substitution, p.ex. dépôt sans courant électrique
18Pré-traitement du matériau à revêtir
CPC
B05D 1/18
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
18performed by dipping
C23C 18/1653
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
C23C 18/1834
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1803of metallic material surfaces or of a non-specific material surfaces
1824by chemical pretreatment
1827only one step pretreatment
1834Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
C23C 18/1893
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1851of surfaces of non-metallic or semiconducting in organic material
1872by chemical pretreatment
1886Multistep pretreatment
1893with use of organic or inorganic compounds other than metals, first
C23C 18/2086
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
2006by other methods than those of C23C18/22 - C23C18/30
2046by chemical pretreatment
2073Multistep pretreatment
2086with use of organic or inorganic compounds other than metals, first
C23C 18/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
30Activating ; or accelerating or sensitising with palladium or other noble metal
Déposants
  • AVENI [FR]/[FR]
  • COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES [FR]/[FR]
Inventeurs
  • VIEL, Pascal
  • SUHR, Dominique
  • BARRAL, Geoffrey
Mandataires
  • CHANTRAINE, Sylvie
  • HUBERT, Philippe
  • HART-DAVIS, Jason
  • LE ROUX, Martine
  • MARRO, Nicolas
  • MENA, Sandra
  • MENDELSOHN, Isabelle
  • NEVANT, Marc
Données relatives à la priorité
155959608.10.2015FR
Langue de publication français (FR)
Langue de dépôt français (FR)
États désignés
Titre
(EN) PROCESS FOR GRAFTING A POLYMERIC THIN FILM ONTO A SUBSTRATE AND PROCESS FOR METALLIZING THIS THIN FILM
(FR) PROCEDE DE GREFFAGE DE FILM MINCE POLYMERIQUE SUR SUBSTRAT ET PROCEDE DE METALLISATION DE CE FILM MINCE
Abrégé
(EN)
One subject of the present invention is a non-electrochemical process for radical grafting of a polymer to a solid, organic or inorganic and insulating, electrically conductive or electrically semiconductive substrate, which process comprises - bringing said substrate into contact with the polymer in solution via an immersion-emersion, a contact coating, or a spray coating, and - heat treating the polymer-covered substrate obtained in the preceding step at a temperature between 70°C and 450°C; said polymer not being a polymer based on acrylic acid. The invention also relates to a process for metallizing the solid, organic or inorganic substrate coated by the polymer film, which metallizing may be carried out via a dry or wet route. This process particularly finds an application in the metallization of through vias for the manufacture of semiconductor devices.
(FR)
La présente invention a pour objet un procédé non électrochimique de greffage, par voie radicalaire, d'un polymère sur un substrat solide, organique ou inorganique et isolant, conducteur de l'électricité, ou semi-conducteur de l'électricité, lequel procédé comprend - la mise en contact dudit substrat avec le polymère en solution par une immersion - émersion, une enduction par contact, ou une enduction par projection, et - un traitement thermique du substrat recouvert de polymère obtenu à l'étape précédente à une température comprise entre 70 et 450 °C; ledit polymère n'étant pas un polymère à base d'acide acrylique. L'invention concerne également un procédé de métallisation du substrat solide organique ou inorganique revêtu par le film de polymère, laquelle métallisation peut être réalisée par voie sèche ou humide. Ce procédé trouve particulièrement application dans la métallisation de vias traversants pour la fabrication de dispositifs semi-conducteurs.
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