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1. (WO2017003613) PROCÉDÉ ET DISPOSITIF DE COUPLAGE DE MULTIPLES RETOURS DE MASSE
Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

CLAIMS

What is claimed is:

1. A ground clip for coupling a plurality of ground planes of a device, said ground clip comprising:

a base portion to secure said ground clip to said device; and

a plurality of spring fingers, each of said spring fingers to contact and electrically couple to one of said ground planes, wherein said ground clip is electrically conductive to provide a conduction path between each of said spring fingers.

2. The ground clip of claim 1, wherein one of said spring fingers passes through an opening in a first of said ground planes to contact a second of said ground planes.

3. The ground clip of claim 1, wherein said ground clip comprises beryllium copper (BeCu).

4. The ground clip of claim 1, wherein said ground clip is plated with gold (Au).

5. The ground clip of any of claims 1-4, wherein one of said ground planes is associated with a display element of said device and grounding is provided to reduce electro- static discharge.

6. The ground clip of claim 5, wherein said display element is an organic light emitting diode (OLED) display element.

7. The ground clip of any of claims 1-4, wherein one of said ground planes is associated with a metal structure configured to provide rigidity for said device.

8. The ground clip of any of claims 1-4, wherein said spring fingers are configured to adapt to manufacturing tolerance variations in relative positions of said ground planes.

9. A method for coupling ground planes of a device, said method comprising:

bonding a ground clip to said device, wherein said ground clip is electrically conductive and comprises a plurality of spring fingers;

configuring a first of said spring fingers to contact a first of said ground planes;

configuring a second of said spring fingers to contact a second of said ground planes;

creating an opening in said second ground plane; and

configuring a third of said spring fingers to contact a third of said ground planes through said opening in said second ground plane.

10. The method of claim 9, wherein said bonding further comprises press fitting said ground clip to a structural member of said device.

11. The method of claim 9, further comprising opening a hole in a portion of said ground clip to receive a plastic stud to secure said ground clip to a structural member of said device using thermoplastic staking.

12. The method of claim 9, wherein said ground clip comprises beryllium copper (BeCu) and is plated with gold (Au).

13. The method of any of claims 9-12, wherein one of said ground planes is associated with a display element of said device and grounding is provided to reduce electro- static discharge.

14. The method of claim 13, wherein said display element is an organic light emitting diode (OLED) display element.

15. The method of any of claims 9-12, wherein one of said ground planes is associated with a metal structure configured to provide rigidity for said device.

16. The method of any of claims 9-12, wherein said spring fingers are configured to adapt to manufacturing tolerance variations in relative positions of said ground planes.

17. A device comprising:

a plurality of ground planes; and

an electrically conductive ground clip comprising:

a base portion to secure said ground clip to said device; and a plurality of spring fingers, each of said spring fingers to contact and electrically couple to one of said plurality of ground planes, wherein said ground clip is to provide a conduction path between each of said spring fingers.

18. The device of claim 17, wherein said device is one of a smart phone, a smart tablet, a personal digital assistant (PDA), a mobile Internet device (MID), a convertible tablet, a notebook or a laptop computer.

19. The device of claim 17, wherein one of said spring fingers passes through an opening in a first of said ground planes to contact a second of said ground planes.

20. The device of claim 17, wherein said ground clip comprises beryllium copper (BeCu).

21. The device of claim 17, wherein said ground clip is plated with gold (Au).

22. The device of any of claims 17-21, further comprising a display element, wherein one of said ground planes is associated with said display element and grounding is provided to reduce electro- static discharge.

23. The device of any of claims 17-21, wherein said display element is an organic light emitting diode (OLED) display element.

24. The device of any of claims 17-21, further comprising a metal structure configured to provide rigidity for said device, wherein one of said ground planes is associated with said metal structure.

25. The device of any of claims 17-21, wherein said spring fingers are configured to adapt to manufacturing tolerance variations in relative positions of said plurality of ground planes.