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1. WO2016140818 - SYSTÈME DE DISTRIBUTION EN ÉVENTAIL UTILISÉ DANS DES BOÎTIERS ET PROCÉDÉ DE FORMATION DE CE DERNIER


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INTERNATIONAL SEARCH REPORT (ISR)
Part 1:  1  2  3  4  5  6          Part 2:  A  B  C  D  E 
International application No. Applicant's or agent's file reference
PCT/US2016/018801 P23951WO1
International filing date (day/month/year) (Earliest) Priority Date (day/month/year)
19 February 2016 03 March 2015
Applicant
APPLE INC.
FOR FURTHER ACTION: See Form PCT/ISA/220 as well as, where applicable, item 5 below.
This international search report has been prepared by this International Searching Authority and is transmitted to the applicant according to Article 18. A copy is being transmitted to the International Bureau.
It is also accompanied by a copy of each prior art document cited in this report.
1. Basis of the report
a. With regard to the language, the international search was carried out on the basis of:
the international application in the language in which it was filed.
a translation of the international application into                                          which is the language of a translation furnished for the purposes of international search (Rules 12.3(a) and 23.1(b)).
b.
This international search report has been established taking into account the rectification of an obvious mistake authorized by or notified to this Authority under Rule 91 (Rule 43.6bis(a)).
c.
With regard to any nucleotide and/or amino acid sequence disclosed in the international application, the international search was carried out on the basis of a sequence listing:
2. Certain claims were found unsearchable
3. Unity of invention is lacking
This International Searching Authority found multiple inventions in this international application, as follows:
1. claims: 1, 2, 5-9, 12-14, 16, 17
Group Ia: Claims 1,2, 5-9 and 12-14,16 and 17 (c.f. claim 2) Re. cl. 2 the surplus technical feature with respect to the known claim 1 (see attached reasoning for the argumentation as to why claim 1 is already disclosed by Document D1) is a plurality of conductive bumps (132) on the second exterior side of the second RDL As all of the features of claim 2 are known from D1 its subject matter therefore cannot form special technical features within the meaning of Rule 44(1) EPC. Although the surplus technical features of the dependent claims 5-9 and 12-14,16 and 17 are not the same, they could be searched without any additional effort and thus they form the basis of the 1st searched invention.
2. claims: 3, 4
Group Ib: Claims 3-4 (c.f claim 3) Re. cl. 3 the surplus technical feature with respect to the known claim 1 is a device bonded to the first exterior side of the first RDL. The problem to be solved by claim 3 is enabling the package for interconnection with other components (see paragraph 57 of the application and figures 14-15)
3. claims: 10, 11
Group Ic: Claims 10,11 (c.f claims 10,11) Re. cl. 10 the surplus technical feature with respect to the known claim 1 is further comprising a third die bonded to the second interior side of the second RDL, wherein the first die is stacked on the second die and the third die. Re. cl. 11 the surplus technical feature with respect to the known claim 1 is further comprising a fourth die bonded to the first interior side of the first RDL, wherein the first die and the fourth die are attached to the second die, and the first die and the fourth die together occupy a larger area than the second die. The problem to be solved by claims 10 and 11 is increasing the density of the package whilst maintaining the same thickness
4. claim: 15
Group Id: Claim 15 Re. cl. 15 the surplus technical feature with respect to the known claim 1 is a conductive bump on the first die is bonded to a contact pad of the first RDL and a layer selected from the group consisting of a non-conductive paste (NCP) and non-conductive film (NCF) laterally surrounds the conductive bump. The problem to be solved by claim 15 is enabling the first die to be bonded to the RDL using an alternative technique such as flip-chip bonding (See paragraph 38 of the application)
5. claims: 18, 19
Group Ie: Claims 18-19 (c.f claim 18) Re. cl. 18 the surplus technical feature with respect to the known claim 17 is that the passive component is bonded to the second interior side of the second RDL. The problem to be solved by claim 18 is ensuring that thick passive components which have higher capacitance, for example, can be incorporated into the package (see par. 53 of the application)
6. claims: 20-23
Group 2: directed towards the subject matter of claims 20-23 (c.f. claim 20) Re. claim 20 the special technical features surplus to the known common concept between claims 1 and 20 are: A method of forming a fan out system in package: forming the first redistribution layer (RDL) on a carrier substrate;forming the plurality conductive pillars on the first RDL; attaching a first die to the first RDL inside a perimeter of the plurality of conductive pillars; forming the second RDL on the molding compound, the second die, and the plurality of conductive pillars. Thus the objective problem of claim 20 to be solved can be construed as: finding an alternative method of making a fan-out system in package.
1.
As all required additional search fees were timely paid by the applicant, this international search report covers all searchable claims.
2.
As all searchable claims could be searched without effort justifying additional fees, this Authority did not invite payment of additional fees.
3.
As only some of the required additional search fees were timely paid by the applicant, this international search report covers only those claims for which fees were paid, specifically claims Nos.: 1, 2, 5-9, 12-14, 16, 17, 20-23
4.
No required additional search fees were timely paid by the applicant. Consequently, this international search report is restricted to the invention first mentioned in the claims; it is covered by claims Nos.:
Remark on Protest
The additional search fees were accompanied by the applicant’s protest and, where applicable, the payment of a protest fee.
The additional search fees were accompanied by the applicant’s protest but the applicable protest fee was not paid within the time limit specified in the invitation.
No protest accompanied the payment of additional search fees.
4. Title of the invention
The text is approved as submitted by the applicant.
The text has been established by this Authority to read as follows:
5. Abstract
The text is approved as submitted by the applicant.
The text has been established, according to Rule 38.2, by this Authority as it appears in Box No. IV. The applicant may, within one month from the date of mailing of this international search report, submit comments to this Authority.

Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die (130,140) between the first (110) and second (210) RDLs, and conductive pillars (120) extending between the RDLs. A molding compound (105) may encapsulate the stacked die and conductive pillars between the first and second RDLs.


6. Drawings
a.
The figure of the drawings to be published with the abstract is Figure No.     11    
as suggested by the applicant.
as selected by this Authority, because the applicant failed to suggest a figure.
as selected by this Authority, because this figure better characterizes the invention.
b.
none of the figures is to be published with the abstract.

A. CLASSIFICATION OF SUBJECT MATTER

     H01L 23/552 (2006.01)i; H01L 23/538 (2006.01)i; H01L 21/60 (2006.01)i; H01L 23/34 (2006.01)i; H01L 25/16 (2006.01)i; H01L 21/56 (2006.01)i
According to International Patent Classification (IPC) or to both national classification and IPC

B. FIELDS SEARCHED

Minimum documentation searched (classification system followed by classification symbols):
     H01L; H05K
Documentation searched other than minimum documentation to the extent that such documents are included in the fields searched:
Electronic data base consulted during the international search (name of data base and, where practicable, search terms used):
EPO-Internal, WPI Data

C. DOCUMENTS CONSIDERED TO BE RELEVANT

Category* Citation of document, with indication, where appropriate, of the relevant passages Relevant to claim No.
(1)
X
US 2007246806 A1 (ONG YOU YANG [SG] ET AL) 25 October 2007 (2007-10-25)
1,2,5-9,12-14,16,17
paragraphs [0032], [0033], [0034], [0035], [0036], [0051], [0052], [0053], [0054], [0065]; figures 1,5-10
(2)
X,P
US 2015303174 A1 (YU CHEN-HUA [TW] ET AL) 22 October 2015 (2015-10-22)
1,2,5-9,13,14,20-23
paragraphs [0102] - [0105], [0110]; figures 16,17c,17d,17e,17f,19e,18,
*
Special categories of cited documents:
"A"
document defining the general state of the art which is not considered to be of particular relevance
"D"
document cited by the applicant in the international application
"E"
earlier application or patent but published on or after the international filing date
"L"
document which may throw doubts on priority claim(s) or which is cited to establish the publication date of another citation or other special reason (as specified)
"O"
document referring to an oral disclosure, use, exhibition or other means
"P"
document published prior to the international filing date but later than the priority date claimed
"T"
later document published after the international filing date or priority date and not in conflict with the application but cited to understand the principle or theory underlying the invention
"X"
document of particular relevance; the claimed invention cannot be considered novel or cannot be considered to involve an inventive step when the document is taken alone
"Y"
document of particular relevance; the claimed invention cannot be considered to involve an inventive step when the document is combined with one or more other such documents, such combination being obvious to a person skilled in the art
"&"
document member of the same patent family

D. INFORMATION ON PATENT FAMILY MEMBERS

Patent document cited in search report Publication date
(day/month/year)
Patent family member(s) Publication date
(day/month/year)
US 2007246806 A1
25 October 2007
US 2007246806 A1
US 2011079899 A1
25 October 2007
07 April 2011
US 2015303174 A1
22 October 2015
NONE
Name and mailing address of the ISA/:
European Patent Office
P.B. 5818, Patentlaan 2, 2280 HV Rijswijk,
Netherlands
Telephone No. (+31-70)340-2040
Facsimile No. (+31-70)340-3016
Date of the actual completion of the international search:
29 August 2016
Date of mailing of the international search report:
07 September 2016
Authorized officer:
Manook, Rhoda
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