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Paramétrages

Paramétrages

1. WO2016140818 - SYSTÈME DE DISTRIBUTION EN ÉVENTAIL UTILISÉ DANS DES BOÎTIERS ET PROCÉDÉ DE FORMATION DE CE DERNIER

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

CLAIMS

What is claimed is:

1. A package comprising:

a first redistribution layer (RDL) including a first interior side and first exterior side; a first die bonded to the first interior side of the first RDL;

a second RDL under the first RDL, the second RDL including a second interior side and second exterior side;

a second die bonded to the second interior side of the second RDL, wherein the first die is stacked on the second die and the first die is not directly electrically coupled with the second die;

a plurality of conductive pillars extending from the first interior side of the first RDL to the second interior side of the second RDL; and

a molding compound located between the first interior side of the first RDL and the second interior side of the second RDL, wherein the molding compound encapsulates the plurality of conductive pillars, the first die, and the second die between the first interior side and the second interior side.

2. The package of claim 1 , further comprising a plurality of conductive bumps on the second exterior side of the second RDL.

3. The package of claim 1, further comprising a device bonded to the first exterior side of the first RDL.

4. The package of claim 3, wherein the device is selected from the group consisting of a lid, a heat spreader, a passive component, an integrated circuit die, and a package.

5. The package of claim 1, wherein the molding compound is a continuous layer of uniform composition between the first interior side of the first RDL and the second interior side of the second RDL and encapsulating the plurality of the conductive pillars the first die, and the second die.

6. The package of claim 1 , wherein the first die is attached to the second die with a die attach film or thermal enhanced tape.

7. The package of claim 1, wherein:

the first die includes a front side with contact pads and a back side that does not include contact pads;

the second die includes a front side with contact pads and a back side that does not include contact pads; and

the front side of the first die is bonded to the first RDL, and the front side of the second die is bonded to the second RDL.

8. The package of claim 7, wherein the back side of the first die faces the back side of the second die.

9. The package of claim 8, wherein the back side of the first die is attached to the back side of the second die with a die attach film.

10. The package of claim 1, further comprising a third die bonded to the second interior side of the second RDL, wherein the first die is stacked on the second die and the third die.

11. The package of claim 1, further comprising a fourth die bonded to the first interior side of the first RDL, wherein the first die and the fourth die are attached to the second die, and the first die and the fourth die together occupy a larger area than the second die.

12. The package of claim 1, wherein the first die comprises a memory device, and the second die comprises a logic device.

13. The package of claim 1, wherein the second RDL includes a redistribution line directly on a contact pad of the second die.

14. The package of claim 1, wherein a conductive bump on the first die is bonded to a contact pad of the first RDL.

15. The package of claim 14, wherein a layer selected from the group consisting of a non-conductive paste (NCP) and non-conductive film (NCF) laterally surrounds the conductive bump.

16. The package of claim 14, wherein an anisotropic conductive film is directly between the conductive bump on the first die and the contact pad of the first RDL.

17. The package of claim 1, further comprising a passive component bonded to the first interior side of the first RDL.

18. The package of claim 17, wherein the passive component is bonded to the second interior side of the second RDL.

19. The package of claim 18, wherein the passive component is integrated as a part of a pattern of the plurality of conductive pillars.

20. A method of forming a fan out system in package:

forming a first redistribution layer (RDL) on a carrier substrate;

forming a plurality conductive pillars on the first RDL;

attaching a first die to the first RDL inside a perimeter of the plurality of conductive pillars;

stacking a second die on the first die;

encapsulating the second die, the first die, and the plurality of conductive pillars in a molding compound; and

forming a second RDL on the molding compound, the second die, and the plurality of conductive pillars.

21. The method of claim 20, further comprising reducing a thickness of the molding compound and the plurality of conductive pillars after encapsulating the second die, the first die, and the plurality of conductive pillars in the molding compound, and prior to forming the second RDL.

22. The method of claim 20, further comprising forming openings in the molding compound to expose lading pads on the second die prior to forming the second RDL.

23. The method of claim 20, further comprising removing a protective film from the second die to expose lading pads on the second die after encapsulating the second die, the first die, and the plurality of conductive pillars in the molding compound, and prior to forming the second RDL.