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1. WO2016089424 - SOURCE DE PLASMA À CATHODE CREUSE

Numéro de publication WO/2016/089424
Date de publication 09.06.2016
N° de la demande internationale PCT/US2014/068858
Date du dépôt international 05.12.2014
CIB
H05H 1/24 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
HTECHNIQUE DU PLASMA; PRODUCTION DE PARTICULES ÉLECTRIQUEMENT CHARGÉES ACCÉLÉRÉES OU DE NEUTRONS; PRODUCTION OU ACCÉLÉRATION DE FAISCEAUX MOLÉCULAIRES OU ATOMIQUES NEUTRES
1Production du plasma; Mise en œuvre du plasma
24Production du plasma
CPC
C23C 16/455
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
44characterised by the method of coating
455characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
C23C 16/50
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
44characterised by the method of coating
50using electric discharges
H01J 2237/3321
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2237Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
32Processing objects by plasma generation
33characterised by the type of processing
332Coating
3321CVD [Chemical Vapor Deposition]
H01J 2237/3325
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2237Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
32Processing objects by plasma generation
33characterised by the type of processing
332Coating
3322Problems associated with coating
3325large area
H01J 37/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32431Constructional details of the reactor
3244Gas supply means
H01J 37/32541
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32431Constructional details of the reactor
32532Electrodes
32541Shape
Déposants
  • AGC GLASS EUROPE, S.A. [BE]/[BE]
  • AGC FLAT GLASS NORTH AMERICA, INC. [US]/[US]
  • ASAHI GLASS CO., LTD. [JP]/[JP]
Inventeurs
  • BIQUET, Thomas
  • MASCHWITZ, Peter
  • CHAMBERS, John
  • WIAME, Hughes
Mandataires
  • ZOLTICK, Martin, M.
Données relatives à la priorité
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) HOLLOW CATHODE PLASMA SOURCE
(FR) SOURCE DE PLASMA À CATHODE CREUSE
Abrégé
(EN)
The present invention relates to a hollow cathode plasma source and to methods for surface treating or coating using such a plasma source, comprising first and second electrodes (1, 2), each electrode comprising an elongated cavity (4), wherein dimensions for at least one of the following parameters is selected so as to ensure high electron density and/or low amount of sputtering of plasma source cavity surfaces, those parameters being cavity cross section shape, cavity cross section area cavity distance (11), and outlet nozzle width (12).
(FR)
La présente invention concerne une source de plasma à cathode creuse et des procédés de traitement ou de revêtement de surface à l'aide d'une telle source de plasma qui comprend des première et seconde électrodes (1, 2), chaque électrode présentant une cavité allongée (4), les dimensions pour au moins l'un des paramètres suivants étant choisies de manière à garantir une haute densité d'électrons et/ou une faible quantité de pulvérisation cathodique des surfaces de la cavité de la source de plasma, ces paramètres représentant la forme de la section transversale de la cavité, la distance (11) de cavité à cavité de la zone de section transversale, et la largeur (12) de la buse de sortie.
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