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1. WO2012148219 - BANDE DE DISSIPATION THERMIQUE UTILISANT UNE FIBRE CONDUCTRICE ET SON PROCÉDÉ DE FABRICATION

Numéro de publication WO/2012/148219
Date de publication 01.11.2012
N° de la demande internationale PCT/KR2012/003295
Date du dépôt international 27.04.2012
CIB
H05K 9/00 2006.1
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
9Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H05K 7/20 2006.1
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
7Détails de construction communs à différents types d'appareils électriques
20Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
C09J 7/02 2006.1
CCHIMIE; MÉTALLURGIE
09COLORANTS; PEINTURES; PRODUITS À POLIR; RÉSINES NATURELLES; ADHÉSIFS; COMPOSITIONS NON PRÉVUES AILLEURS; UTILISATIONS DE SUBSTANCES, NON PRÉVUES AILLEURS
JADHÉSIFS; ASPECTS NON MÉCANIQUES DES PROCÉDÉS DE COLLAGE EN GÉNÉRAL; PROCÉDÉS DE COLLAGE NON PRÉVUS AILLEURS; EMPLOI DE MATÉRIAUX COMME ADHÉSIFS
7Adhésifs sous forme de films ou de pellicules
02sur supports
CPC
C08K 3/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
04Carbon
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
C09J 2301/16
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
10characterized by the structural features of the adhesive tape or sheet
16by the structure of the carrier layer
C09J 2301/314
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
30characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
314the adhesive layer and/or the carrier being conductive
C09J 2301/408
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
40characterized by the presence of essential components
408additives as essential feature of the adhesive layer
C09J 2301/41
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
40characterized by the presence of essential components
41additives as essential feature of the carrier layer
Déposants
  • ㈜솔루에타 SOLUETA [KR]/[KR] (AllExceptUS)
  • 민의홍 MIN, Eui Hong [KR]/[KR] (UsOnly)
Inventeurs
  • 민의홍 MIN, Eui Hong
Mandataires
  • 특허법인 리온 LEEON INTELLECTUAL PROPERTY LAW FIRM
Données relatives à la priorité
10-2011-004033128.04.2011KR
10-2012-004449027.04.2012KR
Langue de publication Coréen (ko)
Langue de dépôt coréen (KO)
États désignés
Titre
(EN) HEAT DISSIPATING TAPE USING CONDUCTIVE FIBER AND METHOD FOR MANUFACTURING SAME
(FR) BANDE DE DISSIPATION THERMIQUE UTILISANT UNE FIBRE CONDUCTRICE ET SON PROCÉDÉ DE FABRICATION
(KO) 전도성 섬유를 이용한 방열테이프 및 그 제조방법
Abrégé
(EN) The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention relates to a heat dissipating tape comprising a heat dissipating adhesion portion having as a conductive base material portion, a conductive fiber coated with a conductive substance, and having a heat dissipating adhesive coated on the conductive base material portion, the heat dissipating adhesive being an acryl adhesive or a silicone adhesive containing graphite. The heat dissipating tape of the present invention has an excellent resistance to external forces on the product, has an excellent outer appearance due to the smooth surface, is less likely to get damaged, and enables the delamination of the conductive base material portion and the heat dissipating adhesion portion to not occur as easily.
(FR) La présente invention concerne une bande de dissipation thermique utilisant une fibre conductrice, et son procédé de fabrication. Plus particulièrement, la présente invention concerne une bande de dissipation thermique comprenant une partie adhésive de dissipation thermique et ayant comme partie conductrice du matériau de base une fibre conductrice recouverte d'une substance conductrice, et comportant un adhésif de dissipation thermique placé sur la partie conductrice du matériau de base, l'adhésif de dissipation thermique étant un adhésif acrylique ou un adhésif silicone contenant du graphite. La bande de dissipation thermique de la présente invention présente une excellente résistance aux forces extérieures sur le produit, ainsi qu'un excellent aspect extérieur en raison de sa surface lisse, risque moins d'être endommagée et évite que la partie conductrice du matériau de base et la partie adhésive de dissipation thermique ne se décollent facilement.
(KO) 본 발명은 전도성 섬유를 이용한 방열테이프 및 그 제조방법에 관한 발명이다. 체적으로는 전도성 물질이 코팅된 전도성 섬유를 전도성 기재부로 하고, 이러한 전도성 기재부에 아크릴 점착제 또는 실리콘 점착제에 그라파이트를 포함한 방열점착제가 도포된 방열점착부를 포함하는 방열테이프에 관한 발명이다. 본 발명 따른 방열테이프는 제품에 외력에 대한 저항성이 우수하며, 또한 표면이 매끈하여 외관이 좋고, 손상이 적으며, 전도성 기재부와 방열점착부의 박리가 쉽게 일어나지 않는 방열테이프에 관한 발명이다.
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