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1. WO2011106730 - STRUCTURES DOTÉES D'ADDITIFS INTÉGRÉS À LEUR SURFACE ET PROCÉDÉS DE FABRICATION CONNEXES

Numéro de publication WO/2011/106730
Date de publication 01.09.2011
N° de la demande internationale PCT/US2011/026362
Date du dépôt international 25.02.2011
CIB
H01B 5/14 2006.1
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
BCÂBLES; CONDUCTEURS; ISOLATEURS; EMPLOI DE MATÉRIAUX SPÉCIFIÉS POUR LEURS PROPRIÉTÉS CONDUCTRICES, ISOLANTES OU DIÉLECTRIQUES
5Conducteurs ou corps conducteurs non isolés caractérisés par la forme
14comprenant des couches ou pellicules conductrices sur supports isolants
CPC
B05D 1/005
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
002the substrate being rotated
005Spin coating
B05D 3/007
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
007After-treatment
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 31/022466
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0224Electrodes
022466made of transparent conductive layers, e.g. TCO, ITO layers
Déposants
  • INNOVA DYNAMICS, INC . [US]/[US] (AllExceptUS)
  • MITTAL, Alexander Chow [US]/[US] (UsOnly)
  • SRINIVAS, Arjun Daniel [US]/[US] (UsOnly)
  • ROBINSON, Matthew R. [US]/[US] (UsOnly)
  • YOUNG, Michael Eugene [US]/[US] (UsOnly)
Inventeurs
  • MITTAL, Alexander Chow
  • SRINIVAS, Arjun Daniel
  • ROBINSON, Matthew R.
  • YOUNG, Michael Eugene
Mandataires
  • LIU, Cliff Z.
Données relatives à la priorité
61/308,89427.02.2010US
61/311,39508.03.2010US
61/311,39608.03.2010US
61/408,77301.11.2010US
61/409,11602.11.2010US
Langue de publication Anglais (en)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS
(FR) STRUCTURES DOTÉES D'ADDITIFS INTÉGRÉS À LEUR SURFACE ET PROCÉDÉS DE FABRICATION CONNEXES
Abrégé
(EN) Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
(FR) Des additifs électroconducteurs ou semi-conducteurs sont intégrés aux surfaces de matériaux hôtes destinés à être utilisés dans divers dispositifs et applications. Les structures obtenues suite à cette intégration présentent de meilleures performances, et leurs compositions ainsi que leurs procédés de fabrication sont plus avantageux en termes de coûts.
Dernières données bibliographiques dont dispose le Bureau international