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1. WO2009076367 - ÉTIQUETTE RÉSONNANTE AVEC UNE DÉPRESSION DE DÉSACTIVATION RENFORCÉE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

CLAIMS
WHAT IS CLAIMED IS:
1. A resonant tag resonating with a radio wave at a predetermined frequency, comprising:
a dielectric film;
a first circuit comprising a first metal foil including a coil portion and a plate portion, which comprises a first plate of a capacitor, formed on one side
of said dielectric film;
a second circuit made of a second metal foil including a plate section
which comprises a second plate of said capacitor, formed on the other side of
said dielectric film;
wherein said both circuits comprise an LC circuit by being electrically
connected; and
wherein a portion of at least one of said capacitor plates is indented
into said dielectric film such that said capacitor plates are closer together at
said indentation than at the remaining portions of said capacitor plates, said
indentation creating means for deactivating said resonant tag circuit in response to
an electromagnetic field of sufficient energy to destroy the resonant properties of said circuit; and
wherein said indentation is physically reinforced.
2. The resonant tag of Claim 1 , wherein said indentation is physically reinforced by addition of material with a perimeter to the tag in the area of said indentation.
3. The resonant tag of Claim 2, further comprising a stress relief at said perimeter of said material, wherein said stress relief comprises a gap in said metal foil of at least one of said capacitor plates.
4. The resonant tag of Claim 2, wherein said material is an epoxy.
5. The resonant tag of Claim 2, wherein said reinforcement material is applied to both of said capacitor plates.
6. The resonant tag of Claim 5, wherein said resonant tag comprises vias through said capacitor plates and dielectric film within said perimeter and said reinforcement material fills said vias.
7. The resonant tag of Claim 2, wherein said material is substantially circular with a diameter of between 2-10 mm.

8. The resonant tag of Claim 1 , wherein said capacitor plates are formed close to an edge of said resonant tag.
9. A capacitor formed as a strap for use in a resonant circuit, which resonates with a radio wave within a predetermined frequency range, comprising:
a first electrically conductive planar element,
a second electrically conductive planar element and
a dielectric disposed between at least portions of said first and second electrically conductive planar elements wherein
at least one of said electrically conductive planar elements is indented into said dielectric such that said electrically conductive planar elements are closer together at said indentation than at the remaining portions of said electrically conductive planar elements, said indentation creating means for altering the capacitance of the capacitor in response to application of a voltage exceeding a predetermined threshold to the capacitor; and wherein
said indentation is physically reinforced.
10. The capacitor of Claim 9, wherein said indentation is physically reinforced by addition of material with a perimeter to the capacitor in the area of said indentation.
11. The capacitor of Claim 10, further comprising a stress relief at said perimeter of said material, wherein said stress relief comprises a gap in at least one of said electrically conductive planar elements.
12. The capacitor of Claim 10, wherein said material is selected form the group consisting of an epoxy acrylics, acrylates, cyanoacrylates, and urethane-acryalates, . acrylates, cyanoacrylates, urethane-acrylates, and polyesters; less common but worthy of inclusion are phenolics, melamines, vinyls, rubbers, and polyesters.
13. The capacitor of Claim 10, wherein said reinforcement material is applied to both of said electrically conductive planar elements.
14. The capacitor of Claim 10, wherein said capacitor comprises vias through said electrically conductive planar elements and said dielectric within said perimeter and said reinforcement material fills said vias.
15. The resonant tag of Claim 14, wherein said material is substantially circular with a diameter of between 2-10 mm.
16. A method for reinforcing a circuit element on a flexible substrate having a top and bottom surface comprising:
creating openings in the substrate between the top and bottom surfaces in the area of the circuit element,
applying a flowable reinforcing material in the area of said circuit element on both sides of the substrate such that said flowable material fills said openings and covers a portion of the top and bottom surface.
17. The method of Claim 16, wherein said flowable material is an epoxy that becomes rigid when cured
18. The method of Claim 16, further comprising applying a potting dam to suπround said area of said circuit element, said potting dam creating a barrier to contain said flowable material to said area of said circuit element.
19. The method of Claim 16, wherein said flowable material Ls applied with a syringe.

20. The method of Claim 16, wherein said flowable material is applied with an ink jet process.
21. The method of Claim 16, wherein said circuit element is a capacitor formed of electrically conducting plates on the top and bottom sides of the substrate and the substrate is a dielectric material,
said capacitor having a portion of at least one of said electrically conductive plates indented in said dielectric such that said electrically conductive plates are closer together at said indentation than at the remaining portions of said electrically conductive plates, said indentation creating means for altering the capacitance of the capacitor in response to application of a voltage exceeding a predetermined threshold to the capacitor, and wherein said reinforced area of said circuit element surrounds said indented portion.
22. The method of Claim 16 wherein said circuit element is affixed to the top surface of the substrate and is electrically connected to conductors on the top surface with wire bonds and wherein said flowable reinforcing material encapsulates the circuit element and said wire bonds,
23. The method of Claim 16 wherein said circuit element is a flip chip device and is affixed to the top surface of the substrate and is electrically connected to conductors on the top surface with solder pads on the underside of the circuit element and wherein said flowable reinforcing material encapsulates the circuit clement.