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1. WO2007145433 - DISPOSITIF SEMI-CONDUCTEUR ET DISPOSITIF TACTILE

Numéro de publication WO/2007/145433
Date de publication 21.12.2007
N° de la demande internationale PCT/KR2007/002567
Date du dépôt international 28.05.2007
CIB
H01L 21/60 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
02Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
04les dispositifs présentant au moins une barrière de potentiel ou une barrière de surface, p.ex. une jonction PN, une région d'appauvrissement, ou une région de concentration de porteurs de charges
50Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes H01L21/06-H01L21/326185
60Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
CPC
G06F 3/044
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
044by capacitive means
H01L 2224/32245
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32245the item being metallic
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/48257
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48257connecting the wire to a die pad of the item
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
Déposants
  • ATLAB INC. [KR/KR]; 3rd Fl., Seokam Bldg., 1082-12 Pungdeokcheon-dong Yongin-si Gyeonggi-do 448-170, KR (AllExceptUS)
  • JUNG, Duck-Young [KR/KR]; KR (UsOnly)
  • CHUNG, Jin-Woo [KR/KR]; KR (UsOnly)
  • LEE, Bang-Won [KR/KR]; KR (UsOnly)
Inventeurs
  • JUNG, Duck-Young; KR
  • CHUNG, Jin-Woo; KR
  • LEE, Bang-Won; KR
Mandataires
  • PARK, Sang-soo; Suite 1810, Hwanghwa Bldg. 832-7, Yoksam-dong Kangnam-ku Seoul 135-936, KR
Données relatives à la priorité
10-2006-005318913.06.2006KR
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) SEMICONDUCTOR DEVICE AND TOUCH SENSOR DEVICE
(FR) DISPOSITIF SEMI-CONDUCTEUR ET DISPOSITIF TACTILE
Abrégé
(EN)
Provided are a semiconductor device and a touch sensor device. The semiconductor device includes a die including a sense signal generator for sensing a touch signal to generate a sense signal; a conductive die-attach pad attached to the die to generate the touch signal; and a package for packaging the die and the die-attach pad, wherein the die-attach pad generates the touch signal depending on whether a touch object comes into contact with the package. The touch sensor device includes a plurality of semiconductor devices connected in a daisy-chain communication mode, wherein each of the semiconductor devices includes a die including a sense signal generator for sensing a touch signal to generate a sense signal; a conductive die-attach pad attached to the die to generate the touch signal; and a package for packaging the die and the die-attach pad, wherein the die-attach pad generates the touch signal depending on whether a touch object is brought into contact with the package. The semiconductor device enables the size and position of a touch pad to be known in advance during the fabrication of a die so that a sensitivity adjusting process can be simplified. Also, since the touch pad is included in a touch sensor, a system can be simply configured at low cost. Furthermore, the touch sensor device requires no additional sensitivity adjusting process and enables a plurality of touch sensor systems to be constructed at low cost by simply connecting a small number of electrical signals.
(FR)
La présente invention concerne un dispositif semi-conducteur et un dispositif tactile. Le dispositif semi-conducteur comprend une puce comprenant un générateur de signal sensitif servant à détecter un signal tactile pour générer un signal sensitif ; une pastille d'attache de puce conductrice fixée à la puce pour générer le signal tactile ; et un emballage servant à emballer la puce et la pastille d'attache de puce. La pastille d'attache de puce génère le signal tactile si un objet tactile entre en contact avec l'emballage. Le dispositif tactile comprend une pluralité de dispositifs semi-conducteurs connectés en mode de communication en guirlande. Chacun des dispositifs semi-conducteurs comprend une puce comprenant un générateur de signal sensitif servant à détecter un signal tactile pour générer un signal sensitif ; une pastille d'attache de puce conductrice fixée à la puce pour générer le signal tactile ; et un emballage servant à emballer la puce et la pastille d'attache de puce. La pastille d'attache de puce génère le signal tactile si un objet tactile est mis en contact avec l'emballage. Le dispositif semi-conducteur permet de connaître à l'avance la taille et la position d'un bloc tactile pendant la fabrication d'une puce, ce qui permet de simplifier le processus d'ajustement de la sensibilité. De plus, comme le bloc tactile est compris dans un capteur tactile, un tel système peut être configuré simplement et économiquement. En outre, le dispositif tactile ne nécessite aucun processus d'ajustement de sensibilité supplémentaire et permet de réaliser économiquement une pluralité de systèmes tactiles en connectant simplement un petit nombre de signaux électriques.
Dernières données bibliographiques dont dispose le Bureau international