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1. WO2007143668 - module mÉmoire thermiquement amÉliorÉ

Numéro de publication WO/2007/143668
Date de publication 13.12.2007
N° de la demande internationale PCT/US2007/070446
Date du dépôt international 05.06.2007
CIB
H05K 7/20 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
7Détails de construction communs à différents types d'appareils électriques
20Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
CPC
H01L 23/3128
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
3121a substrate forming part of the encapsulation
3128the substrate having spherical bumps for external connection
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 25/105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
10the devices having separate containers
105the devices being of a type provided for in group H01L27/00
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/15311
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
151Die mounting substrate
153Connection portion
1531the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
15311being a ball array, e.g. BGA
H05K 1/0206
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
0206by printed thermal vias
Déposants
  • CORSAIR MEMORY [US/US]; 46221 Landing Parkway Fremont, CA 94538, US (AllExceptUS)
  • PAUL, Andy [GB/US]; US (UsOnly)
  • BEEKLEY, John, S. [US/US]; US (UsOnly)
  • LIEBERMAN, Don [US/US]; US (UsOnly)
  • SOLVIN, Dan [US/US]; US (UsOnly)
  • PEARCE, Robert [US/US]; US (UsOnly)
  • MUELLER, Martin, E. [US/US]; US (UsOnly)
Inventeurs
  • PAUL, Andy; US
  • BEEKLEY, John, S.; US
  • LIEBERMAN, Don; US
  • SOLVIN, Dan; US
  • PEARCE, Robert; US
  • MUELLER, Martin, E.; US
Mandataires
  • TAN, Carina, M. ; Morgan Lewis & Bockius LLP 2 Palo Alto Square 3000 El Camino Real, Suite 700 Palo Alto, CA 94306, US
Données relatives à la priorité
11/757,97704.06.2007US
60/811,31705.06.2006US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) THERMALLY ENHANCED MEMORY MODULE
(FR) module mÉmoire thermiquement amÉliorÉ
Abrégé
(EN)
A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.
(FR)
L'invention concerne un module mémoire thermiquement amélioré. Le module mémoire comporte un premier plan électrique étendu et une connexion thermique entre un plan de surface de son substrat et le premier plan électrique étendu. Un premier dispositif de gestion thermique, tel qu'un dissipateur de chaleur, est couplé au plan de surface du substrat et à la connexion thermique.
Dernières données bibliographiques dont dispose le Bureau international