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1. WO2007143661 - Boîtiers bga thermiquement renforcés et procédés

Numéro de publication WO/2007/143661
Date de publication 13.12.2007
N° de la demande internationale PCT/US2007/070436
Date du dépôt international 05.06.2007
CIB
H05K 7/20 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
7Détails de construction communs à différents types d'appareils électriques
20Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
CPC
H01L 2224/32145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32135the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
32145the bodies being stacked
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/48465
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
48463the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
48465the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
H01L 2224/92247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
92Specific sequence of method steps
922Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
9222Sequential connecting processes
92242the first connecting process involving a layer connector
92247the second connecting process involving a wire connector
Déposants
  • TEXAS INSTRUMENTS INCORPORATED [US/US]; P.O. Box 655474 Mail Station 3999 Dallas, TX 75265-5474, US (AllExceptUS)
  • ROMIG, Matthew [US/US]; US (UsOnly)
  • MATHEW, Thomas [IN/US]; US (UsOnly)
Inventeurs
  • ROMIG, Matthew; US
  • MATHEW, Thomas; US
Mandataires
  • TUNG, Yingsheng ; Texas Instruments Incorporated Deputy General Patent Counsel P.O. Box 655474, MS 3999 Dallas, TX 75265-5474, US
Données relatives à la priorité
11/422,86307.06.2006US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) THERMALLY ENCHANCED BGA PACKAGES AND METHODS
(FR) Boîtiers bga thermiquement renforcés et procédés
Abrégé
(EN)
Improved ball grid array (BGA) packages are disclosed in which thermal properties are enhanced by means of a heat channel through the substrate, the heat channel element patterned for receiving solder balls An integrated circuit (IC) chip is coupled to a substrate having a top surface for receiving the IC chip and a bottom surface defining the peπmeter of the package bottom An encapsulant encloses the IC chip and a portion of the substrate top surface, defining the top and sides of the package The substrate includes an aperture for receiving heat channel element having a surface proximal to the IC chip and an opposing surface defining at least an intenor portion of the bottom surface of the package Methods for assembling packages are also disclosed The substrate and heat channel element are temporarily held in position, preferably using tape, during assembly.
(FR)
L'invention concerne des boîtiers à billes (BGA) améliorés (100) dans lesquels des propriétés thermiques sont renforcées au moyen d'un canal thermique à travers le substrat (102). L'élément de canal thermique est modelé pour recevoir des billes de soudure. Un mode de réalisation BGA de l'invention comprend une puce de circuit intégré (IC) couplée de manière opérationnelle à un substrat semi-conducteur ayant une surface supérieure (104) pour recevoir la puce IC (108) et une surface inférieure (110) définissant le périmètre du fond du boîtier. Un enrobant enferme la puce IC et au moins une partie de la surface supérieure du substrat, définissant le haut et les côtés du boîtier. Le substrat comprend une ouverture de canal thermique (112) pour recevoir un élément de canal thermique (114) ayant une surface proximale à la puce IC et ayant une surface opposée définissant au moins une partie intérieure de la surface inférieure du boîtier et modelée pour recevoir les billes de soudure. L'invention concerne également des procédés pour assembler des boîtiers dans lesquels un substrat est obtenu avec une ouverture de canal thermique, et un élément de canal thermique est placé dans celui-ci. Le substrat et l'élément de canal thermique sont maintenus temporairement en position, de préférence à l'aide d'un ruban adhésif, pendant l'assemblage. Des points de fixation de billes de soudure sont disposés à la surface de l'élément de canal thermique pour recevoir les billes de soudure.
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