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1. WO2007143566 - chargement rapide de substrat sur une tête de polissage sans étape de gonflement de membrane

Numéro de publication WO/2007/143566
Date de publication 13.12.2007
N° de la demande internationale PCT/US2007/070243
Date du dépôt international 01.06.2007
CIB
B23B 31/30 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
23MACHINES-OUTILS; TRAVAIL DES MÉTAUX NON PRÉVU AILLEURS
BTOURNAGE; PERÇAGE
31Mandrins de serrage; Mandrins extensibles; Leurs adaptations à la commande à distance
02Mandrins de serrage
24caractérisés par le système de commande à distance des moyens de serrage
30utilisant des moyens hydrauliques ou pneumatiques dans le mandrin
CPC
B24B 37/30
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
H01L 21/67005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
H01L 21/6838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6838with gripping and holding devices using a vacuum; Bernoulli devices
Y10T 279/11
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
279Chucks or sockets
11Vacuum
Y10T 29/5313
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
Déposants
  • APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, CA 95054, US (AllExceptUS)
  • CHEN, Hung Chih [CN/US]; US (UsOnly)
  • OH, Jeonghoon [KR/US]; US (UsOnly)
  • NAGENGAST, Andrew [US/US]; US (UsOnly)
  • ZUNIGA, Steven, M. [US/US]; US (UsOnly)
Inventeurs
  • CHEN, Hung Chih; US
  • OH, Jeonghoon; US
  • NAGENGAST, Andrew; US
  • ZUNIGA, Steven, M.; US
Mandataires
  • PATTERSON, B., Todd ; Patterson & Sheridan, L.l.p. 3040 Post Oak Blvd., Suite 1500 Houston, Texas 77056-6582, US
Données relatives à la priorité
60/810,41502.06.2006US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP
(FR) chargement rapide de substrat sur une tête de polissage sans étape de gonflement de membrane
Abrégé
(EN)
The present invention relates to an apparatus and method for improving and speeding up a substrate loading process. The apparatus (200) includes a base member (208) having a bottom surface (209) with a plurality of recesses (210) formed therein and passages (224,225) formed within to pump a control gas in or out. The apparatus also includes a flexible membrane (205) that forms a center chamber (206) and an edge chamber (207) that may be inflated and deflated independently. A substrate support (201) is used to load a substrate (202) on the apparatus.
(FR)
La présente invention concerne un appareil et un procédé pour améliorer et accélérer un processus de chargement de substrat. Un mode de réalisation permet d'obtenir un procédé de serrage par ventouse d'un substrat. Le procédé comprend la ventilation d'une chambre centrale d'une membrane flexible configurée pour fixer le substrat, le déplacement du substrat de telle sorte qu'une face arrière du substrat est en contact total avec la membrane flexible et l'aspiration de la chambre centrale pour serrer par ventouse la face arrière du substrat sur la membrane flexible.
Également publié en tant que
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