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1. WO2007105426 - PROCEDE ET APPAREIL POUR LA REPARATION D'UN COMPOSANT A SEMICONDUCTEUR

Numéro de publication WO/2007/105426
Date de publication 20.09.2007
N° de la demande internationale PCT/JP2007/053076
Date du dépôt international 20.02.2007
CIB
H01L 21/60 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
02Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
04les dispositifs présentant au moins une barrière de potentiel ou une barrière de surface, p.ex. une jonction PN, une région d'appauvrissement, ou une région de concentration de porteurs de charges
50Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes H01L21/06-H01L21/326185
60Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
CPC
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 2224/48139
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
48139with an intermediate bond, e.g. continuous wire daisy chain
H01L 2224/48175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48153the body and the item being arranged next to each other, e.g. on a common substrate
48175the item being metallic
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
Déposants
  • 株式会社 豊田自動織機 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI [JP]/[JP] (AllExceptUS)
  • 金原 雅彦 KIMBARA, Masahiko [JP]/[JP] (UsOnly)
Inventeurs
  • 金原 雅彦 KIMBARA, Masahiko
Mandataires
  • 恩田 博宣 ONDA, Hironori
Données relatives à la priorité
2006-05382828.02.2006JP
Langue de publication japonais (JA)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) METHOD FOR REPAIRING SEMICONDUCTOR DEVICE AND APPARATUS FOR REPAIRING SEMICONDUCTOR DEVICE
(FR) PROCEDE ET APPAREIL POUR LA REPARATION D'UN COMPOSANT A SEMICONDUCTEUR
(JA) 半導体装置のリペア方法及び半導体装置のリペア装置
Abrégé
(EN)
Disclosed is a method for repairing a semiconductor device which comprises a plurality of semiconductor elements mounted on a circuit board by using a solder. Each semiconductor element is connected to the other semiconductor elements and a wiring portion, which is formed on the circuit board, through a bonding wire. When any one of the semiconductor elements is repaired, firstly the solder is melted by heating the semiconductor element to be removed. Then, the semiconductor element is removed from the circuit board by pulling the bonding wire connected to the semiconductor element while the solder is in a melted state.
(FR)
L'invention concerne un procédé de réparation d'un composant à semiconducteur qui comprend une pluralité d'éléments semiconducteurs montés sur une carte à circuit imprimé en utilisant de la soudure. Chaque élément à semiconducteur est relié aux autres éléments à semiconducteur et à une partie de câblage, laquelle est formée sur la carte à circuit imprimé par l'intermédiaire d'un fil de liaison. Lorsque l'un quelconque des éléments semiconducteurs est réparé, tout d'abord la soudure est fondue par chauffage de l'élément semiconducteur pour qu'il soit retiré. Puis, l'élément semiconducteur est retiré de la carte à circuit imprimé en tirant le fil de liaison relié à l'élément semiconducteur alors que la soudure est à l'état fondu.
(JA)
 回路基板上に半田を使用して実装された複数の半導体素子を備える半導体装置のリペア方法が開示される。各半導体素子は、他の半導体素子及び前記回路基板上に設けられた配線部に対してボンディングワイヤで接続されている。半導体素子のリペアを行う場合には、先ず除去すべき半導体素子を加熱して前記半田を溶融させる。続いて、前記半田が溶融した状態で、前記除去すべき半導体素子に接続されているボンディングワイヤを引っ張って該半導体素子を前記回路基板上から除去する。
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