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1. WO2005008726 - MACHINE DE PUCE A BOSSE

Numéro de publication WO/2005/008726
Date de publication 27.01.2005
N° de la demande internationale PCT/US2004/022026
Date du dépôt international 08.07.2004
CIB
B23K 1/00 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
23MACHINES-OUTILS; TRAVAIL DES MÉTAUX NON PRÉVU AILLEURS
KBRASAGE OU DÉBRASAGE; SOUDAGE; REVÊTEMENT OU PLACAGE PAR BRASAGE OU SOUDAGE; DÉCOUPAGE PAR CHAUFFAGE LOCALISÉ, p.ex. DÉCOUPAGE AU CHALUMEAU; TRAVAIL PAR RAYON LASER
1Brasage ou débrasage
CPC
H01L 21/67132
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67132Apparatus for placing on an insulating substrate, e.g. tape
H01L 21/67144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H01L 2224/11822
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
11Manufacturing methods
118Post-treatment of the bump connector
1182Applying permanent coating, e.g. in-situ coating
11822by dipping, e.g. in a solder bath
H01L 2224/81011
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
81009Pre-treatment of the bump connector or the bonding area
8101Cleaning the bump connector, e.g. oxide removal step, desmearing
81011Chemical cleaning, e.g. etching, flux
H01L 2924/00013
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00013Fully indexed content
H05K 3/3436
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
341Surface mounted components
3431Leadless components
3436having an array of bottom contacts, e.g. pad grid array or ball grid array components
Déposants
  • NEWPORT CORPORATION [US/US]; 1791 Deere Avenue Irvine, CA 92606, US (AllExceptUS)
  • AGRANAT, Edward [US/US]; US (UsOnly)
  • BOUCHÉ, Matthew [US/US]; US (UsOnly)
  • CAREW, Dennis [US/US]; US (UsOnly)
  • CELIA, Nicholas [US/US]; US (UsOnly)
  • CHALSEN, Michael [US/US]; US (UsOnly)
  • DEVASIA, Cyriac [US/US]; US (UsOnly)
  • EVANS, Brian [US/US]; US (UsOnly)
  • GRECO, David [US/US]; US (UsOnly)
  • PASCARIU, Gheorghe [US/SG]; SG (UsOnly)
  • WHEELER, Russell [US/US]; US (UsOnly)
Inventeurs
  • AGRANAT, Edward; US
  • BOUCHÉ, Matthew; US
  • CAREW, Dennis; US
  • CELIA, Nicholas; US
  • CHALSEN, Michael; US
  • DEVASIA, Cyriac; US
  • EVANS, Brian; US
  • GRECO, David; US
  • PASCARIU, Gheorghe; SG
  • WHEELER, Russell; US
Mandataires
  • ANGELLO, Paul, S.; Stoel Rives LLP 900 SW Fifth Avenue, Suite 2600 Portland, OR 97204-1268, US
Données relatives à la priorité
60/486,68809.07.2003US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) FLIP CHIP DEVICE ASSEMBLY MACHINE
(FR) MACHINE DE PUCE A BOSSE
Abrégé
(EN)
A flip chip assembly machine (FCAM) (30) includes a main gantry (50) and a substrate camera gantry (40) that are configured to operate independently of each other and, respectively, support a die (12) and a substrate camera (38) for alignment purposes. The FCAM further includes a fluxer (130) for applying flux to the die. A flip-to-flux pick and place subassembly (116) picks up a die and places it in flux (46) independently of the operation of the main gantry, which may perform another task during the flux dwell time. A substrate carrier conveyor (154) includes a walking beam (260) to rapidly accelerate and decelerate substrate carrier movement into and out of the FCAM.
(FR)
L'invention porte sur une machine de puce à bosse (FCAM) (30) comprenant un portique principal (50) et un portique de caméra-substrat (40) qui sont configurés pour fonctionner indépendamment l'un de l'autre et soutenir respectivement une matrice (12) et une caméra-substrat (38) à des fins d'alignement. Le FCMA comprend aussi un fluxeur (130) afin d'appliquer un flux sur la matrice. Un sous-ensemble de bras de transfert de bosse en flux (116) saisit une matrice et la place dans le flux (46) indépendamment du fonctionnement du portique principal qui peut effectuer une autre tache pendant le temps de maintien du flux. Un transporteur de support de substrat (154) comprend un balancier (260) afin d'accélérer et de ralentir rapidement le mouvement du support de substrat dans et hors du FCMA.
Dernières données bibliographiques dont dispose le Bureau international