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1. WO2005004575 - DISPOSITIF DE POSITIONNEMENT DE COMPOSANTS

Numéro de publication WO/2005/004575
Date de publication 13.01.2005
N° de la demande internationale PCT/IB2004/051086
Date du dépôt international 01.07.2004
CIB
H05K 13/00 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
13Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
CPC
H05K 13/0069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
0069Holders for printed circuit boards
Y10T 29/53174
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
Y10T 29/53178
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
53178Chip component
Y10T 29/53183
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
53183Multilead component
Y10T 29/53187
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53187Multiple station assembly apparatus
Y10T 29/53191
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53191Means to apply vacuum directly to position or hold work part
Déposants
  • ASSEMBLÉON N.V. [NL/NL]; De Run 1110 NL-5503 LA Veldhoven, NL (AllExceptUS)
  • THOMASSEN, Jacobus, A., M. [NL/NL]; NL (UsOnly)
Inventeurs
  • THOMASSEN, Jacobus, A., M.; NL
Mandataires
  • VELDMAN-DIJKERS, Cornelia, G., C.; Algemeen Octrooi- en Merkenbureau De Kennispoort John F. Kennedylaan 2 5612 AB Eindhoven, NL
Données relatives à la priorité
03101995.303.07.2003EP
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) COMPONENT PLACEMENT DEVICE
(FR) DISPOSITIF DE POSITIONNEMENT DE COMPOSANTS
Abrégé
(EN)
Component placement device (11, 21, 31, 41, 51) comprising an elongated transport device (3) by means of which transport device substrates to be provided with components can be moved in a transport direction parallel to the transport device. Furthermore, the component placement device (11, 21, 31, 41, 51) comprises at least one component feeder (5) located along a' longitudinal side of the transport device (3), as well as at least one component pick and place unit (7) by means of which in operation a component can be picked up from the component' feeder and placed on a substrate. The component placement device (11, 21, 31, 41, 51) further comprises a substrate support (15, 22-26, 32, 43, 52) which is located along a longitudinal side of the transport device (3) opposite to the component feeder.
(FR)
Dispositif (11, 21, 31, 41, 51) pour le positionnement de composants, comportant un dispositif transporteur allongé (3) au moyen duquel des substrats de dispositif transporteur à équiper de composants peuvent être déplacés dans une direction de transport parallèle au dispositif transporteur. Par ailleurs, le dispositif (11, 21, 31, 41, 51) de positionnement de composants comporte au moins un appareil (5) d'amenée de composants, cet appareil étant situé au niveau d'un bord longitudinal du dispositif transporteur (3), ainsi qu'au moins une unité (7) de ramassage et de dépose de composants, permettant lors du fonctionnement de ramasser un composant présent sur l'appareil d'amenée de composants, et de le déposer sur un substrat. Le dispositif (11, 21, 31, 41, 51) de positionnement de composants comporte également un support pour substrat (15, 22-26, 32, 43, 52) situé au niveau d'un bord longitudinal du dispositif transporteur (3), en regard de l'appareil d'amenée de composants.
Également publié en tant que
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