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1. WO2004095537 - MODULE MULTI-BOITIER SEMI-CONDUCTEUR COMPRENANT UN PROCESSEUR ET DES ENSEMBLES DE BOITIERS DE MEMOIRE

Numéro de publication WO/2004/095537
Date de publication 04.11.2004
N° de la demande internationale PCT/US2004/008508
Date du dépôt international 19.03.2004
CIB
H01L 25/10 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
25Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
03les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes H01L27/-H01L51/132
10les dispositifs ayant des conteneurs séparés
CPC
H01L 2224/05599
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
05599Material
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/32145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32135the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
32145the bodies being stacked
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/45099
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
Déposants
  • CHIPPAC, INC. [US]/[US] (AllExceptUS)
  • KARNEZOS, Marcos [US]/[US] (UsOnly)
Inventeurs
  • KARNEZOS, Marcos
Mandataires
  • KENNEDY, Bill
Données relatives à la priorité
10/618,93314.07.2003US
60/460,54104.04.2003US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
(FR) MODULE MULTI-BOITIER SEMI-CONDUCTEUR COMPRENANT UN PROCESSEUR ET DES ENSEMBLES DE BOITIERS DE MEMOIRE
Abrégé
(EN)
A semiconductor multi-package module includes a processor (120) and a plurality of memory packages (130), (130´) mounted on a surface of the multi-package module substrate (116). In some embodiments the memory packages include stacked die packages (70), and in some embodiments the memory packages include stacked memory packages. In some embodiments the processor (424) is situated at or near the center of the multi-package module substrate (44) and the plurality of memory packages (30), (30´) or of stacked memory package assemblies (70) are situated on the multi-package module substrate adjacent the processor (420).
(FR)
L'invention concerne un module multi-boîtier semi-conducteur comprenant un processeur et une pluralité de boîtiers de mémoire montés sur une surface du substrat du module multi-boîtier. Suivant certaines formes d'exécution, les boîtiers de mémoire comprennent des boîtiers à puce empilés, dans d'autres formes d'exécution, les boîtiers de mémoire comprennent des boîtiers de mémoire empilés. Selon certaines variantes, le processeur est disposé au centre, ou à proximité du centre du substrat de module multi-boîtier, et la pluralité de boîtiers de mémoire ou des ensembles de boîtiers de mémoire empilés sont disposés sur le substrat du module multi-boîtier adjacent au processeur.
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