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1. WO2004055870 - PROCEDE ET APPAREIL DE MICROCABLAGE

Numéro de publication WO/2004/055870
Date de publication 01.07.2004
N° de la demande internationale PCT/IB2003/005244
Date du dépôt international 17.11.2003
CIB
H01L 21/00 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
CPC
H01L 2224/451
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
H01L 2224/78301
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
78Apparatus for connecting with wire connectors
7825Means for applying energy, e.g. heating means
783by means of pressure
78301Capillary
H01L 2224/85
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
H01L 24/78
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
78Apparatus for connecting with wire connectors
H01L 24/85
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
H01L 2924/00014
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00014the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Déposants
  • KONINKLIJKE PHILIPS ELECTRONICS N.V. [NL]/[NL] (AllExceptUS)
  • KAMPSCHREUR, Thomas, M. [NL]/[NL] (UsOnly)
  • STOKKERMANS, Joep [NL]/[NL] (UsOnly)
  • BAKKER, Arjan, F. [NL]/[NL] (UsOnly)
  • VAN RENS, Piet, C., J. [NL]/[NL] (UsOnly)
  • DE VET, Arnoldus, J., C., B. [NL]/[NL] (UsOnly)
  • VAN DER MEER, Piet [NL]/[NL] (UsOnly)
Inventeurs
  • KAMPSCHREUR, Thomas, M.
  • STOKKERMANS, Joep
  • BAKKER, Arjan, F.
  • VAN RENS, Piet, C., J.
  • DE VET, Arnoldus, J., C., B.
  • VAN DER MEER, Piet
Mandataires
  • DUIJVESTIJN, Adrianus, J.
Données relatives à la priorité
02080360.718.12.2002EP
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) WIREBONDING METHOD AND APPARATUS
(FR) PROCEDE ET APPAREIL DE MICROCABLAGE
Abrégé
(EN)
A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.
(FR)
L'invention concerne un procédé et un appareil de microcâblage de broches de raccordement d'une pluralité de grilles de connexion faisant partie d'un ensemble grilles de connexion à l'aide d'un outil de microcâblage sur des produits semi-conducteurs montés sur les grilles de connexion respectives. Les produits semi-conducteurs sont fixés à l'aide d'un mécanisme de fixation comprenant une mâchoire de fixation fixe et une mâchoire de fixation mobile. La mâchoire de fixation mobile suit le mouvement d'alignement de l'ensemble grilles de connexion lors du microcâblage des produits semi-conducteurs fixés à l'aide de la mâchoire de fixation mobile. L'alignement ne nécessite pas l'interruption du procédé de microcâblage.
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