Commentaires
Paramétrages

Paramétrages

Aller à Demande

1. WO2003098702 - DETECTEUR OPTIQUE, DISPOSITIF A TETE OPTIQUE, DISPOSITIF DE TRAITEMENT DE DONNEES OPTIQUES ET PROCEDE DE TRAITEMENT DE DONNEES OPTIQUES

Lien permanent
Numéro de publication WO/2003/098702
Date de publication 27.11.2003
N° de la demande internationale PCT/JP2003/005669
Date du dépôt international 06.05.2003
Demande présentée en vertu du Chapitre 2 20.08.2003
CIB
H01L 31/0203 2006.1
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
31Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement en énergie électrique, soit comme dispositifs de commande de l'énergie électrique par ledit rayonnement; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails
02Détails
0203Conteneurs; Encapsulations
CPC
G11B 7/13
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation ; by modifying optical properties or the physical structure; , reproducing using an optical beam at lower power ; by sensing optical properties; Record carriers therefor
12Heads, e.g. forming of the optical beam spot or modulation of the optical beam
13Optical detectors therefor
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2924/181
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
181Encapsulation
H01L 31/0203
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0203Containers; Encapsulations ; , e.g. encapsulation of photodiodes
Déposants
  • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP]/[JP] (AllExceptUS)
  • KAMEI, Tomotada [JP]/[JP] (UsOnly)
  • KADOWAKI, Shin-ichi [JP]/[JP] (UsOnly)
Inventeurs
  • KAMEI, Tomotada
  • KADOWAKI, Shin-ichi
Mandataires
  • IKEUCHI SATO & PARTNER PATENT ATTORNEYS
Données relatives à la priorité
2002-13961015.05.2002JP
Langue de publication Japonais (ja)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) OPTICAL DETECTOR, OPTICAL HEAD DEVICE, OPTICAL INFORMATION PROCESSING DEVICE, AND OPTICAL INFORMATION PROCESSING METHOD
(FR) DETECTEUR OPTIQUE, DISPOSITIF A TETE OPTIQUE, DISPOSITIF DE TRAITEMENT DE DONNEES OPTIQUES ET PROCEDE DE TRAITEMENT DE DONNEES OPTIQUES
front page image
Abrégé
(EN) An optical detector comprising a semiconductor chip (1) for converting received light into an electric signal, and a resin body (2) sealing the semiconductor chip (1) and having translucency, wherein the optical detector further comprise a protector (3), which covers at least the light transmission region (11), through which light is transmitted, of the surface of the resin body on which the light falls. Covering the light transmission region (11) by the protector (3) that is less in reactivity with light than the resin body (2) suppresses deformation of the resin body (2) due to light, thus suppressing degradation of the optical characteristics of the optical detector.
(FR) L'invention concerne un détecteur optique comprenant une puce (1) à semi-conducteur permettant de convertir la lumière reçue en un signal électrique, et un corps (2) de résine translucide encapsulant la puce (1) à semi-conducteur. Ce détecteur optique comprend en outre un élément de protection (3) qui couvre au moins la zone (11) de transmission optique de la surface du corps de résine sur laquelle la lumière arrive et à travers laquelle la lumière est transmise. La couverture de la zone (11) de transmission optique par un élément de protection (3) présentant une réactivité à la lumière inférieure à celle du corps (2) de résine permet de supprimer la déformation du corps (2) de résine par la lumière, et de supprimer ainsi la dégradation des caractéristiques optiques du détecteur optique.
Documents de brevet associés
CN1653622
AU2003235850
JPWO2003098702
US20060164959
Dernières données bibliographiques dont dispose le Bureau international
# -