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1. WO2003023087 - MOULAGE DE RESINE DEPOSEE ET PROCEDE DE PRODUCTION CORRESPONDANT

Numéro de publication WO/2003/023087
Date de publication 20.03.2003
N° de la demande internationale PCT/JP2002/009231
Date du dépôt international 10.09.2002
CIB
C23C 18/20 2006.01
CCHIMIE; MÉTALLURGIE
23REVÊTEMENT DE MATÉRIAUX MÉTALLIQUES; REVÊTEMENT DE MATÉRIAUX AVEC DES MATÉRIAUX MÉTALLIQUES; TRAITEMENT CHIMIQUE DE SURFACE; TRAITEMENT DE DIFFUSION DE MATÉRIAUX MÉTALLIQUES; REVÊTEMENT PAR ÉVAPORATION SOUS VIDE, PAR PULVÉRISATION CATHODIQUE, PAR IMPLANTATION D'IONS OU PAR DÉPÔT CHIMIQUE EN PHASE VAPEUR, EN GÉNÉRAL; MOYENS POUR EMPÊCHER LA CORROSION DES MATÉRIAUX MÉTALLIQUES, L'ENTARTRAGE OU LES INCRUSTATIONS, EN GÉNÉRAL
CREVÊTEMENT DE MATÉRIAUX MÉTALLIQUES; REVÊTEMENT DE MATÉRIAUX AVEC DES MATÉRIAUX MÉTALLIQUES; TRAITEMENT DE SURFACE DE MATÉRIAUX MÉTALLIQUES PAR DIFFUSION DANS LA SURFACE, PAR CONVERSION CHIMIQUE OU SUBSTITUTION; REVÊTEMENT PAR ÉVAPORATION SOUS VIDE, PAR PULVÉRISATION CATHODIQUE, PAR IMPLANTATION D'IONS OU PAR DÉPÔT CHIMIQUE EN PHASE VAPEUR, EN GÉNÉRAL
18Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement; Dépôt par contact
16par réduction ou par substitution, p.ex. dépôt sans courant électrique
18Pré-traitement du matériau à revêtir
20de surfaces organiques, p.ex. de résines
CPC
C23C 18/208
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
2006by other methods than those of C23C18/22 - C23C18/30
2046by chemical pretreatment
2073Multistep pretreatment
208with use of metal first
C23C 18/2086
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
2006by other methods than those of C23C18/22 - C23C18/30
2046by chemical pretreatment
2073Multistep pretreatment
2086with use of organic or inorganic compounds other than metals, first
C23C 18/24
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
22Roughening, e.g. by etching
24using acid aqueous solutions
C23C 18/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
30Activating ; or accelerating or sensitising with palladium or other noble metal
Y10T 428/31605
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
31504Composite [nonstructural laminate]
31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
31605Next to free metal
Y10T 428/31609
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
31504Composite [nonstructural laminate]
31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
31609Particulate metal or metal compound-containing
Déposants
  • DAICEL POLYMER LTD. [JP]/[JP] (AllExceptUS)
  • TAI, Toshihiro [JP]/[JP] (UsOnly)
  • TONOSAKI, Ippei [JP]/[JP] (UsOnly)
Inventeurs
  • TAI, Toshihiro
  • TONOSAKI, Ippei
Mandataires
  • FURUYA, Kaoru
Données relatives à la priorité
2001-27444711.09.2001JP
2001-36310928.11.2001JP
2002-10076803.04.2002JP
Langue de publication japonais (JA)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) PLATED RESIN MOLDING AND PROCESS FOR PRODUCING THE SAME
(FR) MOULAGE DE RESINE DEPOSEE ET PROCEDE DE PRODUCTION CORRESPONDANT
Abrégé
(EN)
A process for producing a plated resin molding by plating the surface of a thermoplastic resin molding with a metal, which satisfies any of the following requirements (1), (2), and (3): (1) the thermoplastic resin molding comprises a thermoplastic resin and a water−soluble substance and the process includes the step of degreasing the resin molding and the step of electroless plating and does not include the step of etching with an acid containing a heavy metal; (2) the thermoplastic resin molding comprises a polyamide resin and a styrene resin and the process includes the step of degreasing the resin molding and the step of electroless plating and does not include the step of etching with an acid containing a heavy metal; and (3) the process includes as a pretreatment for a metal plating step, a step in which the thermoplastic resin molding is treated by contact with an acid or base containing no heavy metals. Also provided is a plated resin molding obtained by the process. In the plated resin molding, the deposit layer has high adhesion strength although etching with chromic acid was not conducted.
(FR)
L'invention concerne un procédé de production d'un moulage de résine déposée par dépôt de la surface d'un moulage de résine thermoplastique au moyen d'un métal. Ce procédé satisfait toutes les exigences (1), (2) et (3): (1) le moulage de résine thermoplastique comprend une résine thermoplastique et une substance hydrosoluble et le procédé comprend l'étape de dégraissage du moulage de résine et l'étape de dépôt autocatalytique et ne comprend pas l'étape de gravure au moyen d'un acide contenant un métal lourd; (2) le moulage de résine thermoplastique comprend une résine polyamide et une résine styrène et le procédé comprend l'étape de dégraissage du moulage de résine et l'étape de dépôt autocatalytique et ne comprend pas l'étape de gravure au moyen d'un acide contenant un métal lourd; et (3) le procédé comprend en tant que pré-traitement destiné à une étape de dépôt de métal une étape dans laquelle le moulage de résine thermoplastique est traité par mise en contact avec un acide ou une base ne contenant pas de métaux lourds. L'invention concerne également le moulage d'une résine déposée obtenue au moyen de ce procédé. Dans le moulage de résine déposée, la couche de dépôt possède une force d'adhésion élevée bien que la gravure au moyen d'un acide chromique n'ait pas eu lieu.
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