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1. WO2003008921 - TECHNIQUE D'ISOLATION POUR STRUCTURE DE DÉTECTION DE PRESSION

Numéro de publication WO/2003/008921
Date de publication 30.01.2003
N° de la demande internationale PCT/US2001/022816
Date du dépôt international 18.07.2001
CIB
G01L 9/00 2006.01
GPHYSIQUE
01MÉTROLOGIE; TESTS
LMESURE DES FORCES, DES CONTRAINTES, DES COUPLES, DU TRAVAIL, DE LA PUISSANCE MÉCANIQUE, DU RENDEMENT MÉCANIQUE OU DE LA PRESSION DES FLUIDES
9Mesure de la pression permanente, ou quasi permanente d'un fluide ou d'un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d'un fluide ou d'un matériau solide fluent
CPC
G01L 19/0069
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
0061Electrical connection means
0069from the sensor to its support
G01L 19/0645
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
0627Protection against aggressive medium in general
0645using isolation membranes, specially adapted for protection
G01L 19/146
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
145with stress relieving means
146using flexible element between the transducer and the support
G01L 19/147
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
147Details about the mounting of the sensor to support or covering means
G01L 9/0042
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements
0041Transmitting or indicating the displacement of flexible diaphragms
0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
Déposants
  • MEASUREMENT SPECIALTIES, INC. [US/US]; 1701 McCarthy Blvd. Milpitas, CA 95035, US (AllExceptUS)
  • WAGNER, David, E. [US/US]; US (UsOnly)
  • LOPOPOLO, Gerald [US/US]; US (UsOnly)
  • HOFFMAN, James, H. [US/US]; US (UsOnly)
Inventeurs
  • WAGNER, David, E.; US
  • LOPOPOLO, Gerald; US
  • HOFFMAN, James, H.; US
Mandataires
  • WALSH, Chad, R. ; Townsend and Townsend and Crew LLP 2 Embarcadero Center 8th Floor San Francisco, CA 94111, US
Données relatives à la priorité
09/908,46317.07.2001US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) ISOLATION TECHNIQUE FOR PRESSURE SENSING STRUCTURE
(FR) TECHNIQUE D'ISOLATION POUR STRUCTURE DE DÉTECTION DE PRESSION
Abrégé
(EN)
A pressure sensor (100) in accordance with the invention comprises a die (101) having pressure-sensing electrical components formed in a first side (101b) of the die (101). In one embodiment, a method of securing a cap (119) to silicon die (101) is provided comprising forming a thin glass particle layer (702 on a bonding area (119c) of the cap (119), heating the cap (119) and the thin glass particle layer (702) on the bonding area (119c) to form a substantially continuous glass layer (702) on the bonding area (119c), and heating the cap (119) and silicon die (101) to a temperature above the melting point of the glass to form a bond between the cap (119) and the silicon die (101).
(FR)
L'invention concerne un détecteur (100) de pression pourvu d'une puce (101) qui comprend des composants électriques de détection de pression formés dans une première face (101b) de la puce (101). Dans une forme de réalisation, l'invention concerne un procédé permettant de fixer un capuchon (119) sur une puce (101) de silicium, qui comporte les étapes consistant à : former une couche (702) mince de particules de verre sur une zone (119c) de liaison du capuchon (119) ; chauffer le capuchon (119) et la couche (702) ) mince de particules de verre sur la zone (119c) de liaison pour former une couche (702) de verre sensiblement continue sur la zone (119c) de liaison ; et chauffer le capuchon (119) et la puce (101) de silicium à une température supérieure au point de fusion du verre pour former une liaison entre le capuchon (119) et la puce (101) de silicium.
Également publié en tant que
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