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1. WO2003007451 - PROTECTION DE LIMITATION DE TENSION POUR DISPOSITIF DE PUISSANCE HAUTE FREQUENCE

Numéro de publication WO/2003/007451
Date de publication 23.01.2003
N° de la demande internationale PCT/US2002/022198
Date du dépôt international 12.07.2002
Demande présentée en vertu du Chapitre 2 10.02.2003
CIB
H03K 17/0812 2006.01
HÉLECTRICITÉ
03CIRCUITS ÉLECTRONIQUES FONDAMENTAUX
KTECHNIQUE DE L'IMPULSION
17Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts
08Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension
081sans réaction du circuit de sortie vers le circuit de commande
0812par des dispositions prises dans le circuit de commande
CPC
H01L 2223/6655
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6644Packaging aspects of high-frequency amplifiers
6655Matching arrangements, e.g. arrangement of inductive and capacitive components
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 2224/48195
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48153the body and the item being arranged next to each other, e.g. on a common substrate
48195the item being a discrete passive component
H01L 23/60
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
60Protection against electrostatic charges or discharges, e.g. Faraday shields
H01L 23/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
64Impedance arrangements
66High-frequency adaptations
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
Déposants
  • CREE MICROWAVE, INC. [US/US]; 160 Gibraltar Court Sunnyvale, CA 94089, US
Inventeurs
  • BREWER, Kenneth, P.; US
  • BARTLOW, Howard, D.; US
  • DARMAWAN, Johan, A.; US
Mandataires
  • WOODWARD, Henry, K.; Beyer Weaver & Thomas, LLP 2030 Addison Street, 7th Floor Berkley, CA 94704, US
Données relatives à la priorité
09/905,29413.07.2001US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) VOLTAGE LIMITING PROTECTION FOR HIGH FREQUENCY POWER DEVICE
(FR) PROTECTION DE LIMITATION DE TENSION POUR DISPOSITIF DE PUISSANCE HAUTE FREQUENCE
Abrégé
(EN)
An RF power device comprising a power transistor fabricated in a first semiconductor chip and a MOSCAP type structure fabricated in a second semiconductor chip. A voltage limiting device is provided for protecting the power transistor from input voltage spikes and is preferably fabricated in the semiconductor chip along with the MOSCAP. Alternatively, the voltage limiting device can be a discrete element fabricated on or adjacent to the capacitor semiconductor chip. By removing the voltage limiting device from the power transistor chip, fabrication and testing of the voltage limiting device is enhanced, and semiconductor area for the power device is increased and aids in flexibility of device fabrication.
(FR)
L'invention concerne un dispositif de puissance hyperfréquence qui comprend un transistor fabriqué dans une première puce semi-conductrice et une structure de type MOSCAP fabriquée dans une deuxième puce semi-conductrice. Un dispositif de limitation de tension permet de protéger le transistor de puissance des pointes de tensions d'entrée, et est de préférence fabriqué dans la puce semi-conductrice avec le MOSCAP. En variante, le dispositif de limitation de tension peut être un élément discret fabriqué sur la puce semi-conductrice de type condensateur ou disposé de manière adjacente à celle-ci. Par retrait du dispositif de limitation de tension de la puce du transistor de puissance, la fabrication et les essais dudit dispositif de limitation de tension sont améliorés, et la superficie semi-conductrice du dispositif de puissance est augmentée et contribue à la flexibilité de la fabrication du dispositif.
Dernières données bibliographiques dont dispose le Bureau international