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1. WO2003000454 - CAPILLAIRE A ATTENUATION CONTROLEE A SURFACE PLANE

Numéro de publication WO/2003/000454
Date de publication 03.01.2003
N° de la demande internationale PCT/US2002/014855
Date du dépôt international 08.05.2002
Demande présentée en vertu du Chapitre 2 16.01.2003
CIB
B23K 20/00 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
23MACHINES-OUTILS; TRAVAIL DES MÉTAUX NON PRÉVU AILLEURS
KBRASAGE OU DÉBRASAGE; SOUDAGE; REVÊTEMENT OU PLACAGE PAR BRASAGE OU SOUDAGE; DÉCOUPAGE PAR CHAUFFAGE LOCALISÉ, p.ex. DÉCOUPAGE AU CHALUMEAU; TRAVAIL PAR RAYON LASER
20Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p.ex. revêtement ou placage
CPC
B23K 20/005
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
002specially adapted for particular articles or work
004Wire welding
005Capillary welding
B23K 20/106
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10making use of vibrations, e.g. ultrasonic welding
106Features related to sonotrodes
B23K 2101/32
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
32Wires
H01L 2224/45015
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
4501Shape
45012Cross-sectional shape
45015being circular
H01L 2224/45124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
45124Aluminium (Al) as principal constituent
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
Déposants
  • KULICKE & SOFFA INVESTMENTS, INC. [US/US]; Little Falls Center Two 2751 Centerville Road Suite 3165 Wilmington, DE 19808, US
Inventeurs
  • MILLER, Amir; IL
  • PERLBERG, Gil; IL
Mandataires
  • ETKOWICZ, Jacques, L. ; Ratner & Prestia 301 One Westlakes (Berwyn) P.O.Box 980 Valley Forge, PA 19482-0980, US
Données relatives à la priorité
09/886,56021.06.2001US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) CONTROLLED ATTENUATION CAPILLARY WITH PLANAR SURFACE
(FR) CAPILLAIRE A ATTENUATION CONTROLEE A SURFACE PLANE
Abrégé
(EN)
A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section (1302) having a substantially uniform first diameter and a second (1304) cylindrical section with a substantially uniform second diameter less than the first diameter. The second cylindrical section is coupled to an end of the first cylindrical section and has a planar area (1303, 1305) along at lest a portion of a length of the second section.
(FR)
L'invention concerne un outil de liaison à atténuation commandée permettant de lier un fil fin à un substrat. L'outil de liaison comprend une première section cylindrique (1302) dont un premier diamètre est sensiblement uniforme, et une seconde section cylindrique (1304) dont un second diamètre, inférieur au premier diamètre, est sensiblement uniforme. La seconde section cylindrique, couplée à une extrémité de la première section cylindrique, présente une surface plane (1303, 1305) longeant la seconde section sur au moins une partie de sa longueur.
Également publié en tant que
PH1-2003-500720
PH12003500720
Dernières données bibliographiques dont dispose le Bureau international