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1. WO1999003062 - CARTE A CIRCUIT INTEGRE SANS CONTACTS

Numéro de publication WO/1999/003062
Date de publication 21.01.1999
N° de la demande internationale PCT/JP1998/002540
Date du dépôt international 08.06.1998
Demande présentée en vertu du Chapitre 2 18.12.1998
CIB
G06K 19/077 2006.1
GPHYSIQUE
06CALCUL; COMPTAGE
KRECONNAISSANCE DES DONNÉES; PRÉSENTATION DES DONNÉES; SUPPORTS D'ENREGISTREMENT; MANIPULATION DES SUPPORTS D'ENREGISTREMENT
19Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques
06caractérisés par le genre de marque numérique, p.ex. forme, nature, code
067Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit
07avec des puces à circuit intégré
077Détails de structure, p.ex. montage de circuits dans le support
CPC
G06K 19/077
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07749
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
G06K 19/0775
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
0775arrangements for connecting the integrated circuit to the antenna
H01L 2224/05568
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
0556Disposition
05568the whole external layer protruding from the surface
H01L 2224/05573
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
05573Single external layer
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
Déposants
  • ROHM CO., LTD. [JP]/[JP] (AllExceptUS)
  • IKEFUJI, Yoshihiro [JP]/[JP] (UsOnly)
  • OKADA, Hiroharu [JP]/[JP] (UsOnly)
Inventeurs
  • IKEFUJI, Yoshihiro
  • OKADA, Hiroharu
Mandataires
  • FUKAMI, Hisao
Données relatives à la priorité
9/18470210.07.1997JP
Langue de publication Japonais (ja)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) NONCONTACT IC CARD
(FR) CARTE A CIRCUIT INTEGRE SANS CONTACTS
Abrégé
(EN) A noncontact IC card (1, 2, 30, 50) provided with a substrate (10), a coil (12, 32, 52, 57) provided on the substrate, and an IC chip (11, 31, 51) electrically connected to the coil (12, 32, 52, 57), and a major surface (11c, 31c, 51e). The IC chip (11, 31, 51) has terminals (11a, 11b, 31a, 31b, 51a, 51b, 51c, 51d) formed on the major surface (11c, 31c, 51e), and the coil (12, 32, 52, 57) has a coil inner end (12b, 32b, 52b, 57b) connected electrically to the terminal (11b, 31b, 51b, 51d) and a coil outer end (12a, 32a, 52a, 57a) connected electrically to the terminal (11a, 31a, 51a, 57c). The IC chip (11, 31, 51) is mounted on the coil (12, 32, 52, 57) in such a way that the coil inner end (12b, 32b, 52b, 57b) is close to the terminal (11b, 31b, 51b, 51d) and the coil outer end (12a, 32a, 52a, 57a) is close to the terminal (11a, 31a, 51a, 51c).
(FR) Cette invention concerne une carte à circuit intégré (1, 2, 30, 50) sans contacts, laquelle comprend un substrat (10), une bobine (12, 32, 52, 57) disposée sur le substrat, ainsi qu'une puce à circuit intégré (11, 31, 51) qui est connectée électriquement à la bobine (12, 32, 52, 57) ainsi qu'à une surface principale (11c, 31c, 51e). La puce à circuit intégré (11, 31, 51) possède des bornes (11a, 11b, 31a, 31b, 51a, 51b, 51c, 51d) qui sont formées sur la surface principale (11c, 31c, 51e). La bobine (12, 32, 52, 57) possède quant à elle une extrémité interne (12b, 32b, 52b, 57b) qui est connectée électriquement à la borne (11b, 31b, 51b, 51d), ainsi qu'une extrémité externe (12a, 32a, 52a, 57a) qui est connectée électriquement à la borne (11a, 31a, 51a, 57c). La puce à circuit intégré (11, 31, 51) est montée sur la bobine (12, 32, 52, 57) de manière à ce que l'extrémité interne (12b, 32b, 52b, 57b) de celle-ci se trouve à proximité de la borne (11b, 31b, 51b, 51d), et à ce que son extrémité externe (12a, 32a, 52a, 57a) se trouve à proximité de la borne (11a, 31a, 51a, 51c).
Dernières données bibliographiques dont dispose le Bureau international