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1. (WO1998000840) EXTREMITE DE TETE MAGNETIQUE A COUCHE MINCE ET SON PROCEDE DE FABRICATION
Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique
CLAIMS:
1. A thin film magnetic head tip comprising:
a wafer (100) being a non-magnetic insulator;
a conductive contact point (210) within a plurality of holes formed through the wafer (100);
a base (120) being a non-magnetic insulator, stacked on the wafer;
a magnetic core (110) being partially within the base (120), having an azimuth groove (140); and
a coil (130) within the base (120) wound around the core, having two ends each connected to the conductive contact points (210).
2. A thin film magnetic head tip as claimed in claim 1 , comprising a curved surface (150) formed being curved together with the surface of the magnetic core (110) with the azimuth groove (140) and the base (120).
3. A thin film magnetic head tip as claimed in claim 1 or 2. wherein the conductive contact point (120) is formed of metal.
4. A method for manufacturing a thin film magnetic head tip comprising the steps of:
(a) forming a plurality of holes passing through a wafer ( 100);
(b) filling the holes with a conductive material;
(c) stacking a base (120) being a non-magnetic insulator, a magnetic core

(1 10) having an azimuth groove (140). and a coil (130) within the base (120) around the magnetic core (110) on the wafer (100) in a predetermined shape by a wafer process; and
(d) cutting the stacked wafer into thin film magnetic head tips.
5. A method for manufacturing a thin film magnetic head tip as claimed in claim 4. wherein the magnetic core (1 10) and the base (120) are stacked in a staircase shape to form a curved surface (150) curved together with the surface of the magnetic core (110) with the azimuth groove (140) and the base (120) during the step (c).
6. A method for manufacturing a thin film magnetic head tip as claimed in claim 4 or 5. wherein in the step (c). a predetermined material is sequentially deposited on the wafer (100) in a predetermined shape by deposition and photolithography methods.