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1. WO1993018627 - ENSEMBLE MICROPHONE ELECTRET ET PROCEDE DE FABRICATION DUDIT MICROPHONE

Numéro de publication WO/1993/018627
Date de publication 16.09.1993
N° de la demande internationale PCT/US1993/000954
Date du dépôt international 03.02.1993
Demande présentée en vertu du Chapitre 2 01.10.1993
CIB
H04R 19/04 2006.01
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
RHAUT-PARLEURS, MICROPHONES, TÊTES DE LECTURE POUR TOURNE-DISQUES OU TRANSDUCTEURS ACOUSTIQUES ÉLECTROMÉCANIQUES ANALOGUES; APPAREILS POUR SOURDS; SYSTÈMES D'ANNONCE EN PUBLIC
19Transducteurs électrostatiques
04Microphones
CPC
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2924/3011
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
30Technical effects
301Electrical effects
3011Impedance
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
H04R 2225/49
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2225Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
49Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
Déposants
  • KNOWLES ELECTRONICS, INC. [US]/[US]
Inventeurs
  • LENZINI, Ernest, L.
  • WICKSTROM, Timothy, K.
Mandataires
  • STINE, Thomas, K.
Données relatives à la priorité
07/847,65605.03.1992US
07/930,00613.08.1992US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) ELECTRET MICROPHONE ASSEMBLY, AND METHOD OF MANUFACTURE
(FR) ENSEMBLE MICROPHONE ELECTRET ET PROCEDE DE FABRICATION DUDIT MICROPHONE
Abrégé
(EN)
An electret microphone assembly, such as for a hearing aid comprises an electret microphone having a diaphragm and a charged plate, a substrate spaced from the charged plate, and a wire loop having first and second ends and a mid-portion. The first and second ends are secured to the substrate and the mid-portion is pressed against the charged plate. An amplifier is disposed on the substrate and has an input terminal coupled to the wire loop. Alternatively, an impedance matching circuit can be disposed on the substrate and coupled to the wire loop. A conductive bond containing silver particles futher secures the wire loop mid-portion and the charged plate. In an alternative configuration the loop is dimensioned such that its mid-portion passes close to the charged plate without touching it. The conductive bond serves not only to form a rigid structure, but also serves as an electrical bridge to complete the circuit between the two elements.
(FR)
Ensemble microphone électret, tel que pour une prothèse auditive, qui comprend un microphone électret doté d'un diaphragme et d'une plaque chargée, un substrat placé à distance de ladite plaque chargée et une boucle de fil dotée de première et seconde extrémités et d'une partie médiane. Les première et seconde extrémités sont fixées au substrat et la partie médiane est pressée contre la plaque chargée. Un amplificateur est placé sur le substrat et comporte un terminal d'entrée couplé à la boucle de fil. Alternativement, un circuit d'adaptation des impédances peut être placé sur le substrat et couplé à la boucle de fil. Une liaison conductrice contenant des particules d'argent constitue une fixation supplémentaire entre la partie médiane de la boucle de fil et la plaque chargée. Dans une autre configuration, la boucle présente une dimension telle que sa partie médiane passe près de la plaque chargée sans la toucher. La liaison conductrice sert non seulement à former une structure rigide, mais également de pont électrique destiné à compléter le circuit entre les deux éléments.
Également publié en tant que
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