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1. WO1989005571 - MODULE HERMETIQUE DE BROCHES EN GRILLE A FAIBLE COUT

Numéro de publication WO/1989/005571
Date de publication 15.06.1989
N° de la demande internationale PCT/US1988/004347
Date du dépôt international 09.12.1988
CIB
H01L 23/498 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
23Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
48Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
488formées de structures soudées
498Connexions électriques sur des substrats isolants
CPC
H01L 2224/45124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
45124Aluminium (Al) as principal constituent
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 23/49827
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H01L 24/45
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
Déposants
  • CABOT ELECTRONICS CERAMICS, INC. [US]/[US]
Inventeurs
  • JONES, Kenneth, L., II
  • O'CONNER, Tom, R.
  • TREVELLYAN, Kenneth, A.
Mandataires
  • GARMONG, Gregory, O.
Données relatives à la priorité
130,46909.12.1987US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) LOW COST, HERMETIC PIN GRID ARRAY PACKAGE
(FR) MODULE HERMETIQUE DE BROCHES EN GRILLE A FAIBLE COUT
Abrégé
(EN)
A pin grid array package (20) includes an electrically insulating, moisture impervious base (22) having a plurality of bores (28) therethrough, electrically conducting pins (30) extending through the bores (28), metallic collars (50) wedged between the pins (30) and the bores (28) adjacent the bottom side (26) of the base (20), and electrically conducting trace (42) formed of a silver-2 percent platinum alloy extending from each pin (20) to the location (38) for attachment of an electrical device (36), and a melted eutectic bond (60) between the metal of the conducting path (44) and the head (32) of the pin (20) at the top side (24) of the base (22).
(FR)
Un module (20) de broches en grille comprend une base (22) électro-isolante et imperméable à l'humidité percée d'une pluralité d'alésages (28), des broches électroconductrices (30) qui traversent les alésages (28), des collets métalliques (50) coincés entre les broches (30) et les alésages (28), adjacents au côté inférieur (26) de la base (20), une piste électroconductrice (42) en un alliage d'argent et de 2 % de platine qui s'étend de chaque broche (20) jusqu'à l'endroit (38) de connexion à un dispositif électrique (36), et un lien eutectique fusionné (60) formé entre le métal de la piste conductrice (44) et la tête (32) de la broche (20) au côté supérieur (24) de la base (22).
Également publié en tant que
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