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1. WO1988004847 - ASSEMBLAGE DE MIRROIR POUR LASERS

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

CIAIMS
The embodiments of the invention in which an exclusive property or right is claimed are defined as follows :
1. A mirror assembly comprising:
a mirror chip including a first substrate having
first and second oppositely facing surfaces, said first surface having at least one mirror material deposited thereon to form a mirror; a second substrate having a first surface for
supporting said first substrate; and
a thin film of a thermally sealable bonding agent bonding together and in between said first
surface of said second substrate and said
second surface of said first substrate.

2. The mirror assembly of claim 1 wherein said first substrate is comprised of silicon.

3. The mirror assembly of claim 2 wherein said mirror material includes alternating layers of dielectric materials.

4. The mirror assembly of claim 1 wherein said mirror material includes a plurality of alternating layers of at least two dielectric materials deposited on said first surface to form a highly reflective mirror.

5. The mirror assembly of claim 1 wherein said first substrate is comprised of silicon and said mirror material is comprised of alternating layers of silicon dioxide and titanium dioxide.

6. The mirror assembly of claim 1 wherein said first substrate is comprised of silicon and said mirror material is comprised of alternating layers of silicon dioxide and zirconium dioxide.

7. The mirror assembly of claim 1 wherein said bonding agent is film of glass.

8. The mirror assembly of claim 1 wherein said bonding agent is a vacuum sputtered glass film
deposited on said second surface of said first
substrate.

9. The mirror assembly of claim 1 wherein said bonding agent is a vacuum sputtered glass film
deposited on said second surface of said first
substrate.

10. A ring laser angular rate sensor comprising:
a mechanically thermally stable block having a
plurality of interconnecting tunnels; and
a mirror assembly having,
a mirror chip including a first substrate
having first and second oppositely
facing surfaces, said first surface
having at least one mirror material
deposited thereon to form a mirror, and a second substrate having a first surface for
supporting said first substrate, said
second substrate including a second
surface for affixing said second
substrate to said block, and
a thin film of a thermally sealable bonding
agent bonding together and in between
said first surface of second substrate
and said second surface of said first
substrate; and said second substrate is posistioned on said block so that said mirror intercepts one of said
interconnecting tunnels.
11. The mirror assembly of claim 10 wherein said first substrate is comprised of silicon.

12. The mirror assembly of claim 11 wherein said mirror material includes alternating layers of
dielectric materials.

13. The mirror assembly of claim 10 wherein said mirror material includes a plurality of alternating layers of at least two dielectric materials deposited on said first surface to form a highly reflective mirror.

14. The mirror assembly of claim 10 wherein said first substrate is comprised of silicon and said mirror material is comprised of alternating layers of silicon dioxide and .titanium dioxide.

15. The mirror assembly of claim 10 wherein said first substrate is comprised of silicon and said mirror material is. comprised of alternating layers of silicon dioxide and zirconium dioxide.

16. The mirror assembly of claim 10 wherein said bonding agent is film of glass.

17. The mirror assembly of claim 10 wherein said bonding agent is a vacuum sputtered glass film deposited on said second surface of said first substrate.

18. The mirror assembly of claim 10 wherein said bonding agent is a vacuum sputtered glass film deposited on said second surface of said first substrate.