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Machine translation
1. (WO1979000083) PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1979/000083    International Application No.:    PCT/US1978/000055
Publication Date: 22.02.1979 International Filing Date: 27.07.1978
IPC:
H05K 3/42 (2006.01), H05K 3/06 (2006.01), H05K 3/24 (2006.01), H05K 3/34 (2006.01), H05K 3/10 (2006.01), H05K 3/18 (2006.01), H05K 3/28 (2006.01), H05K 3/38 (2006.01)
Applicants:
Inventors:
Priority Data:
821604 03.08.1977 US
Title (EN) PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS
(FR) PROCEDE DE FABRICATION DE PLAQUES DE CIRCUITS IMPRIMES
Abstract: front page image
(EN)Printed circuits are fabricated by a process which employs initial chemical deposition of copper (12) on a predrilled substrate (11) followed by electroplating build-up of conductors (16) to desired pattern. The conductors (16) are then passivated by thinly plating them with a mechanically durable, chemically passive metal (17). To provide solder compatibility in are (15) where connections are to be made to the printed circuits, a plating of tin/lead (19) is applied in those are while masking (18) all other are to eliminate plating. The remaining exposed copper (12) is then etched away. An insulating solder mask (21) is then applied.
(FR)Les circuits imprimes sont fabriques par un procede qui consiste a appliquer un depot chimique initial de cuivre (12) sur un substrat preperfore (11) puis a rapporter les conducteurs (16) en les formant par electro-deposition jusqu"a l"obtention du format desire. Les conducteurs (16) sont ensuite passives par depot d"une couche mince d"un metal (17) mecaniquement durable et chimiquement passif. La soudabilite dans les zones (15) ou des connections devront etre faites sur les circuits imprimes est assuree par un placage d"etain/plomb (19) applique sur ces zones, toutes les autres parties etant cachees (18) pour echapper au placage. Le cuivre expose restant (12) est ensuite enleve par attaque acide. Un cache isolant de soudage (21) est alors applique.
Designated States:
Publication Language: English (EN)
Filing Language: English (EN)