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1. US20210357602 - ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL MODULE

Office
États-Unis d'Amérique
Numéro de la demande 16478044
Date de la demande 14.03.2019
Numéro de publication 20210357602
Date de publication 18.11.2021
Type de publication A1
CIB
G06K 9/00
GPHYSIQUE
06CALCUL; COMPTAGE
KRECONNAISSANCE DES DONNÉES; PRÉSENTATION DES DONNÉES; SUPPORTS D'ENREGISTREMENT; MANIPULATION DES SUPPORTS D'ENREGISTREMENT
9Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H01L 27/32
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
27Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun
28comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux
32avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
CPC
G10K 11/162
GPHYSICS
10MUSICAL INSTRUMENTS; ACOUSTICS
KSOUND-PRODUCING DEVICES
11Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
16Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
162Selection of materials
G06K 9/0002
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
0002by non-optical methods, e.g. by ultrasonic or capacitive sensing
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 27/3234
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3225OLED integrated with another component
3234the other component being an imager structure
Déposants WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Inventeurs Dong ZHAN
Données relatives à la priorité 201910095238.X 31.01.2019 CN
Titre
(EN) ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL MODULE
Abrégé
(EN)

An organic light emitting diode (OLED) display panel module includes a cover plate, a first adhesive agent, a circular polarizer, an OLED display panel, and an ultrasonic fingerprint recognition module. The ultrasonic fingerprint recognition module is disposed at a lower surface of the OLED display panel. Both sides of the OLED display panel module are provided with a sound absorbing layer, both sides of the ultrasonic fingerprint recognition module are provided with the sound absorbing layer, and a portion of the lower surface of the OLED display panel not contacted the ultrasonic fingerprint recognition module is provided with the sound absorbing layer.


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