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1. MYPI 2020005418 - ELECTROSTATIC COATING DEVICE FOR RESIN MOLDED ARTICLES AND ELECTROSTATIC COATING METHOD FOR RESIN MOLDED ARTICLES

Office
Malaisie
Numéro de la demande PI 2020005418
Date de la demande 19.04.2018
Numéro de publication PI 2020005418
Date de publication 19.10.2019
Type de publication A
CIB
B
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
B
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
B
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
Déposants HONDA MOTOR CO., LTD.
Inventeurs YAMATO Takahiro
UMEKI Koji
Mandataires TIMOTHY SIAW YEAN HWA
Titre
(EN) ELECTROSTATIC COATING DEVICE FOR RESIN MOLDED ARTICLES AND ELECTROSTATIC COATING METHOD FOR RESIN MOLDED ARTICLES
Abrégé
(EN) An electrostatic coating device for resin-molded articles includes a feed jig 12 connected to the ground 90 for holding resin-molded articles 2 in contact therewith, a cleaning device 20 for cleaning the resin-molded articles 2, an electrically conductive agent applying device 30 for coating surfaces of the resin-molded articles 2 with an electrically conductive agent dissolved or dispersed in a surface active agent, an overcoating device 23 for applying a paint to the surfaces of the resin-molded articles 2, and a feed device 10 for moving the feed jig 12 and the resin-molded articles 2, wherein the electrically conductive agent applying device 30 includes a plurality of nozzles 77 installed in predetermined positions for atomizing the electrically conductive agent into a mist and enclosing walls 68 enclosing the plurality of the nozzles 77 to define a mist space M containing the atomized electrically conductive agent, the feed device 10 moves the feed jig 12 holding the resin-molded articles 2 in contact therewith in the mist space M, and the electrically conductive agent applying device 30 coats the resin-molded articles 2 and the feed jig 12 with the electrically conductive agent in the mist space M. The electrostatic coating device reduces the amount used of the electrically conductive agent to be applied to the resin-molded articles and the feed jig and also reduces facility expenses for the electrostatic coating device for resin-molded articles. Figure 2