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1. KR1020160083548 - LED LIGHTING APPARATUS

Office
République de Corée
Numéro de la demande 1020140195667
Date de la demande 31.12.2014
Numéro de publication 1020160083548
Date de publication 12.07.2016
Type de publication A
CIB
F21V 29/70
FMÉCANIQUE; ÉCLAIRAGE; CHAUFFAGE; ARMEMENT; SAUTAGE
21ÉCLAIRAGE
VCARACTÉRISTIQUES FONCTIONNELLES OU DÉTAILS FONCTIONNELS DES DISPOSITIFS OU SYSTÈMES D'ÉCLAIRAGE; COMBINAISONS STRUCTURALES DE DISPOSITIFS D'ÉCLAIRAGE AVEC D'AUTRES OBJETS, NON PRÉVUES AILLEURS
29Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
50Dispositions de refroidissement
70caractérisées par des éléments passifs de dissipation de chaleur, p.ex. puits thermiques
CPC
F21V 29/70
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
Déposants ICEPIPE CORPORATION
Inventeurs LEE, DONG JU
Titre
(EN) LED LIGHTING APPARATUS
Abrégé
(EN)
Disclosed is an LED lighting apparatus which has high heat radiation performance while having a simple structure. According to an aspect of the present invention, the LED lighting apparatus comprises: a printed circuit board formed with a plate structure; an LED chip mounted on one surface of the printed circuit board; a support coupled to the other surface of the printed circuit board; and a heat sink coupled to the support to cool heat generated in the LED chip. The support has a discontinuous through-hole passing through both surfaces. A part of the heat sink is coupled to the support by being inserted into the through-hole from one surface of the support to be in contact with the printed circuit board. COPYRIGHT KIPO 2016