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1. KR1020120094039 - 가요성 조립체, 및 그의 제조 및 사용 방법

Office
République de Corée
Numéro de la demande 1020127015475
Date de la demande 17.11.2010
Numéro de publication 1020120094039
Date de publication 23.08.2012
Type de publication A
CIB
H01L 31/042
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
31Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement en énergie électrique, soit comme dispositifs de commande de l'énergie électrique par ledit rayonnement; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails
04adaptés comme dispositifs de conversion photovoltaïque
042Modules PV ou matrices de cellules PV individuelles
C09J 7/00
CCHIMIE; MÉTALLURGIE
09COLORANTS; PEINTURES; PRODUITS À POLIR; RÉSINES NATURELLES; ADHÉSIFS; COMPOSITIONS NON PRÉVUES AILLEURS; UTILISATIONS DE SUBSTANCES, NON PRÉVUES AILLEURS
JADHÉSIFS; ASPECTS NON MÉCANIQUES DES PROCÉDÉS DE COLLAGE EN GÉNÉRAL; PROCÉDÉS DE COLLAGE NON PRÉVUS AILLEURS; EMPLOI DE MATÉRIAUX COMME ADHÉSIFS
7Adhésifs sous forme de films ou de pellicules
B32B 27/00
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
32PRODUITS STRATIFIÉS
BPRODUITS STRATIFIÉS, c. à d. FAITS DE PLUSIEURS COUCHES DE FORME PLANE OU NON PLANE, p.ex. CELLULAIRE OU EN NID D'ABEILLES
27Produits stratifiés composés essentiellement de résine synthétique
CPC
H01L 31/03923
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
0248characterised by their semiconductor bodies
036characterised by their crystalline structure or particular orientation of the crystalline planes
0392including thin films deposited on metallic or insulating substrates ; ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
03923including AIBIIICVI compound materials, e.g. CIS, CIGS
H01L 31/048
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic [PV] conversion devices
042PV modules or arrays of single PV cells
048Encapsulation of modules
C09J 7/20
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
C09J 9/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
B32B 7/12
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
04Interconnection of layers
12using interposed adhesives or interposed materials with bonding properties
C09J 7/29
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
29Laminated material
Déposants 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Inventeurs 브하르티 비베크
헤브링크 티모시 제이
헨더슨 앤드류 제이
젠넨 제이 엠
나치티갈 알란 케이
패트노드 그레그 에이
리치터 칼 비
로에리그 마크 에이
웨이겔 마크 디
Mandataires 김영
양영준
Données relatives à la priorité 61/262,406 18.11.2009 US
61/262,417 18.11.2009 US
Titre
(KO) 가요성 조립체, 및 그의 제조 및 사용 방법
Abrégé
(KO)
중합체 필름 기재 및 배리어 필름을 포함하는 배리어 조립체 상에 배치되고 두께가 0.25 ㎜ 이상인 감압 접착제 층을 포함하는 조립체가 제공된다. 상기 조립체는 가요성이며 가시광 및 적외광에 대해 투과성이다. 중량평균 분자량이 300,000 그램/몰 미만인 폴리아이소부틸렌 및 수소화된 탄화수소 점착부여제를 포함하며, 두께가 0.25 ㎜ 이상인 필름의 형태인 감압 접착제가 또한 제공된다. 상기 조립체 및 상기 감압 접착제를 제조하는 방법 및 사용하는 방법이 또한 포함된다.