(EN) PROBLEM TO BE SOLVED: To provide a defect inspecting device which performs high-speed inspection under a plurality of optical conditions when inspecting defects or foreign substances existing within a semiconductor wafer.
SOLUTION: This defect inspection device is used for inspecting the defect, such as, foreign substance on a sample having a circuit pattern, such as wiring. The defect inspecting device includes a lighting optical system which emits each of a plurality of straight beams onto different inspection regions on the sample, and an imaging optical system which images the plurality of emitted inspection regions onto a detector. The detector is constituted so as to receive a plurality of mutually different polarization components to each other, which are contained in each of a plurality of optical images imaged by the imaging optical system simultaneously and separately, and detect them as a plurality of signals corresponding to the plurality of polarization components.
COPYRIGHT: (C)2010,JPO&INPIT
【課題】半導体ウェハなどに存在する欠陥または異物を検査する際に、複数の光学条件での検査を高速に行う欠陥検査装置及びその方法を提供することにある。
【解決手段】配線等の回路パターンを有する試料上の異物等の欠陥を検査するための欠陥検査装置において、複数の直線状ビームの各々を試料上の異なる検査領域に照射する照明光学系と、該照射された複数の検査領域を検出器上に結像する結像光学系とを備え、前記検出器は、前記結像光学系で結像された複数の光像の各々に含まれる互いに異なる複数の偏光成分をほぼ同時にかつ個別に受光して前記複数の偏光成分に対応する複数の信号として検出するように構成したことを特徴とする。
【選択図】図１