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1. JP2009276273 - DEFECT INSPECTING DEVICE AND METHOD FOR INSPECTING DEFECT

Office Japon
Numéro de la demande 2008129314
Date de la demande 16.05.2008
Numéro de publication 2009276273
Date de publication 26.11.2009
Numéro de délivrance 5466377
Date de délivrance 31.01.2014
Type de publication B2
CIB
G01N 21/956
GPHYSIQUE
01MÉTROLOGIE; TESTS
NRECHERCHE OU ANALYSE DES MATÉRIAUX PAR DÉTERMINATION DE LEURS PROPRIÉTÉS CHIMIQUES OU PHYSIQUES
21Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c. à d. en utilisant des rayons infrarouges, visibles ou ultraviolets
84Systèmes spécialement adaptés à des applications particulières
88Recherche de la présence de criques, de défauts ou de souillures
95caractérisée par le matériau ou la forme de l'objet à analyser
956Inspection de motifs sur la surface d'objets
H01L 21/66
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
66Test ou mesure durant la fabrication ou le traitement
CPC
G01N 21/95607
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
95607using a comparative method
G01N 21/9501
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
9501Semiconductor wafers
G01N 2021/9563
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
9563and suppressing pattern images
Déposants HITACHI HIGH-TECHNOLOGIES CORP
株式会社日立ハイテクノロジーズ
Inventeurs NAKANO HIROYUKI
中野 博之
MAEDA SHUNJI
前田 俊二
NAKADA TOSHIHIKO
中田 俊彦
Mandataires ポレール特許業務法人
Titre
(EN) DEFECT INSPECTING DEVICE AND METHOD FOR INSPECTING DEFECT
(JA) 欠陥検査装置
Abrégé
(EN)

PROBLEM TO BE SOLVED: To provide a defect inspecting device which performs high-speed inspection under a plurality of optical conditions when inspecting defects or foreign substances existing within a semiconductor wafer.

SOLUTION: This defect inspection device is used for inspecting the defect, such as, foreign substance on a sample having a circuit pattern, such as wiring. The defect inspecting device includes a lighting optical system which emits each of a plurality of straight beams onto different inspection regions on the sample, and an imaging optical system which images the plurality of emitted inspection regions onto a detector. The detector is constituted so as to receive a plurality of mutually different polarization components to each other, which are contained in each of a plurality of optical images imaged by the imaging optical system simultaneously and separately, and detect them as a plurality of signals corresponding to the plurality of polarization components.

COPYRIGHT: (C)2010,JPO&INPIT

(JA)

【課題】半導体ウェハなどに存在する欠陥または異物を検査する際に、複数の光学条件での検査を高速に行う欠陥検査装置及びその方法を提供することにある。
【解決手段】配線等の回路パターンを有する試料上の異物等の欠陥を検査するための欠陥検査装置において、複数の直線状ビームの各々を試料上の異なる検査領域に照射する照明光学系と、該照射された複数の検査領域を検出器上に結像する結像光学系とを備え、前記検出器は、前記結像光学系で結像された複数の光像の各々に含まれる互いに異なる複数の偏光成分をほぼ同時にかつ個別に受光して前記複数の偏光成分に対応する複数の信号として検出するように構成したことを特徴とする。
【選択図】図1

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