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Paramétrages

Paramétrages

1. EP3144415 - SOLUTION DE PLACAGE POUR ACCOUPLEMENT FILETE DE TUYAUX OU TUBES ET PROCEDE DE FABRICATION POUR ACCOUPLEMENT FILETE DE TUYAUX OU TUBES

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique
Claims

1. A plating solution for a threaded connection for pipe or tube, the plating solution containing no cyanide,
the plating solution comprising:

copper pyrophosphate of 3g/L or more in terms of copper;

tin pyrophosphate;

zinc pyrophosphate;

pyrophosphate as a metal complexing agent; and

one or more sulfur-containing compounds of 0.01 to 40 g/L selected from a mercapto compound defined by Chemical Formula (1), a sulfide compound defined by Chemical Formula (1), a dimer formed through a disulfide bond of the mercapto compounds, and salts thereof:

        RS-(CHX1)m-(CHX2)n-CHX3X4     (1),

where each of m and n is an integer of 1 or 0; each of X1, X2, X3 and X4 is any one of hydrogen, OH, NH2, SO3H, and CO2H, but excluding that X1, X2, X3, and X4 are all hydrogen; and R is any one of hydrogen, a methyl group, and an ethyl group.


  2. A producing method of a threaded connection for pipe or tube comprising:

a step of preparing a plating solution containing no cyanide,

the plating solution comprising:

copper pyrophosphate;

tin pyrophosphate;

zinc pyrophosphate;

pyrophosphate as a metal complexing agent; and

one or more sulfur-containing compounds of 0.01 to 40 g/L selected from a mercapto compound defined by Chemical Formula (1), a sulfide compound defined by Chemical Formula (1), a dimer formed through a disulfide bond of the mercapto compounds, and salts thereof:

        RS-(CHX1)m-(CHX2)n-CHX3X4     (1),

where each of m and n is an integer of 1 or 0; each of X1, X2, X3 and X4 is any one of hydrogen, OH, NH2, SO3H, and CO2H, but excluding that X1, X2, X3, and X4 are all hydrogen; and R is any one of hydrogen, a methyl group, and an ethyl group; and

a step of subjecting a pin or a box of the threaded connection to electroplating using the plating solution so as to form a Cu-Sn-Zn alloy plating film on the pin or the box.


  3. Use of a plating solution as an electroplating solution for a threaded connection for pipe or tube, the plating solution containing no cyanide,
the plating solution comprising:

copper pyrophosphate;

tin pyrophosphate;

zinc pyrophosphate;

pyrophosphate as a metal complexing agent; and

one or more sulfur-containing compounds of 0.01 to 40 g/L selected from a mercapto compound defined by Chemical Formula (1), a sulfide compound defined by Chemical Formula (1), a dimer formed through a disulfide bond of the mercapto compounds, and salts thereof:

        RS-(CHX1)m-(CHX2)n-CHX3X4     (1),

where each of m and n is an integer of 1 or 0; each of X1, X2, X3 and X4 is any one of hydrogen, OH, NH2, SO3H, and CO2H, but excluding that X1, X2, X3, and X4 are all hydrogen; and R is any one of hydrogen, a methyl group, and an ethyl group.


  4. A threaded connection for pipe or tube comprising a pin and a box, the pin and the box each including a contact surface that includes a threaded portion and a non-threaded metal contact portion, the threaded connection for pipe or tube comprising, on the contact surface of the pin or the box, an alloy plating layer comprising a Cu-Sn-Zn alloy obtainable by electroplating using a plating solution containing no cyanide,
the plating solution comprising:

copper pyrophosphate;

tin pyrophosphate;

zinc pyrophosphate;

pyrophosphate as a metal complexing agent; and

one or more sulfur-containing compounds of 0.01 to 40 g/L selected from a mercapto compound defined by Chemical Formula (1), a sulfide compound defined by Chemical Formula (1), a dimer formed through a disulfide bond of the mercapto compounds, and salts thereof:

        RS-(CHX1)m-(CHX2)n-CHX3X4     (1),

where each of m and n is an integer of 1 or 0; each of X1, X2, X3 and X4 is any one of hydrogen, OH, NH2, SO3H, and CO2H, but excluding that X1, X2, X3, and X4 are all hydrogen; and R is any one of hydrogen, a methyl group, and an ethyl group.