DE000010334578 Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls

Es wird eine Chipkarte zur kontaktbehafteten Datenübertragung, bestehend aus einem Kartenkörper und einem in den Kartenkörper eingebauten Chipkartenmodul mit: DOLLAR A einem Halbleiterchip mit einer Rückseite, mit einer aktiven Oberseite und mit Seitenflächen; einer den Halbleiterchip umhüllenden Kunststoffgehäusemasse, die zumindest eine Oberfläche aufweist, die koplanar zu der aktiven Oberseite des Halbleiterchips ist; einer ersten dielektrischen Schicht, die auf diese Oberfläche und auf der aktiven Oberseite des Halbleiterchips angeordnet ist; einer oder mehrerer über weitere dielektrische Schichten getrennte Umverdrahtungsmetallisierungsebenen, die mit der aktiven Oberseite des Halbleiterchips verbunden sind; und Außenkontaktflächen, die auf der äußersten Umverdrahtungsebene ausgebildet sind, auf die eine Kontaktmetallisierung für eine kontaktbehaftete Datenübertragung aufgebracht ist, vorgeschlagen. Das Chipkartenmodul zeichnet sich durch ein sehr geringes Bauvolumen aus, da keine Bonddrähte verwendet werden.

Également publié en tant que

EP1649412

US20060175419

WO/2005/015488

G	PHYSIQUE
06	CALCUL; COMPTAGE
K	RECONNAISSANCE DES DONNÉES; PRÉSENTATION DES DONNÉES; SUPPORTS D'ENREGISTREMENT; MANIPULATION DES SUPPORTS D'ENREGISTREMENT
19	Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques
06	caractérisés par le genre de marque numérique, p.ex. forme, nature, code
067	Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit
07	avec des puces à circuit intégré
077	Détails de structure, p.ex. montage de circuits dans le support

G	PHYSIQUE
06	CALCUL; COMPTAGE
K	RECONNAISSANCE DES DONNÉES; PRÉSENTATION DES DONNÉES; SUPPORTS D'ENREGISTREMENT; MANIPULATION DES SUPPORTS D'ENREGISTREMENT
19	Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques
06	caractérisés par le genre de marque numérique, p.ex. forme, nature, code
067	Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit
07	avec des puces à circuit intégré
077	Détails de structure, p.ex. montage de circuits dans le support

G	PHYSICS
06	COMPUTING; CALCULATING; COUNTING
K	RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19	Record carriers for use with machines and with at least a part designed to carry digital markings
06	characterised by the kind of the digital marking, e.g. shape, nature, code
067	Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07	with integrated circuit chips
077	Constructional details, e.g. mounting of circuits in the carrier
07743	External electrical contacts

G	PHYSICS
06	COMPUTING; CALCULATING; COUNTING
K	RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19	Record carriers for use with machines and with at least a part designed to carry digital markings
06	characterised by the kind of the digital marking, e.g. shape, nature, code
067	Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07	with integrated circuit chips
077	Constructional details, e.g. mounting of circuits in the carrier
07745	Mounting details of integrated circuit chips

G	PHYSICS
06	COMPUTING; CALCULATING; COUNTING
K	RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19	Record carriers for use with machines and with at least a part designed to carry digital markings
06	characterised by the kind of the digital marking, e.g. shape, nature, code
067	Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07	with integrated circuit chips
077	Constructional details, e.g. mounting of circuits in the carrier
07745	Mounting details of integrated circuit chips
07747	at least one of the integrated circuit chips being mounted as a module

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1. DE000010334578 - Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls

WIPO Translate

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50	Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56	Encapsulations, e.g. encapsulation layers, coatings
561	Batch processing

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
48	Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488	consisting of soldered ; or bonded; constructions
498	Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49855	for flat-cards, e.g. credit cards

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
52	Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538	the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5389	the chips being integrally enclosed by the interconnect and support structures

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42	Wire connectors; Manufacturing methods related thereto
47	Structure, shape, material or disposition of the wire connectors after the connecting process
48	of an individual wire connector

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42	Wire connectors; Manufacturing methods related thereto
47	Structure, shape, material or disposition of the wire connectors after the connecting process
49	of a plurality of wire connectors