(EN)
A light emitting device is provided, comprising a light emitting diode 10, where the light emitting surface 11 thereof is bound to an optical element 13 by means of a bonding material 12 comprising a phosphate glass or an oxide glass having a glass transition temperature Tg <250 -C. In operation of the device, when the temperature approaches or exceeds Tg of the bonding material, the bonding material gets fluidic and can thus relax any thermally induced stresses between the light emitting diode and the optical element.
(ZH) 提供一种发光器件，包括发光二极管10，其中发光二极管10的发光表面11借助于结合材料12结合到光学元件13，所述结合材料包括具有Tg＜250℃的玻璃转化温度的磷酸盐玻璃或氧化物玻璃。在器件工作中，当温度接近或超过结合材料的Tg时，结合材料变成流体并且能够因此缓和在发光二极管和光学元件之间的任何热引发应力。