(EN)
The present invention relates to a device for applying a semiconductor treatment to a treatment subject substrate (W), including a lifting mechanism (48) disposed on a table (38) for assisting in delivering the treatment subject substrate. The lifting mechanism includes lifter pins (51) for supporting and lifting/lowering the treatment subject substrate, and guide holes (49) for guiding the lifting/lowering movement of the lifter pins. Each guide hole comprises a main hole portion (49a) extending from the upper surface to the lower surface and through the table, and an extension hole portion (49b) extending into an extension sleeve (66) projecting downward from the lower surface of the table correspondingly to the main hole portion.
(ZH) 本发明涉及对被处理基板(W)进行半导体处理的装置，包含配置在载置台(38)上的，辅助进行被处理基板的运送的升降机构(48)。升降机构包含支承和使被处理基板升降的升降机销子(51)和引导升降机销子的升降动作的导向孔(49)。导向孔具有贯通载置台，从上表面延伸至下表面的主孔部分(49a)，和与主孔部分对应在从载置台的下表面向下方突出的延长套管(66)内延伸的延长孔部分(49b)。